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				意法半导 STMICROELECTRONICS[STMicroelectronics]
Part No.	M14128 D10 D22 ST1331 ST1336 ST14C02C C20 C30 D15 D20 M14256 M14C04 M14C16 M14C32 M14C64 M35101 M35102 ST1200 ST1305B ST1333 ST1335
OCR Text	...ct area Reject Criteria Glue or particles, scratches print, sever defects on contact area damaging the gold layer. Visual test distance 30 cm, naked eye. Thickness and external dimension measurement exceeding total thickness, or other dimen...
Description	Memory Card IC 256/128 Kbit Serial IC Bus EEPROM Memory Micromodules General Information for D1/ D2 and C Packaging Memory Micromodules General Information for D1, D2 and C Packaging Memory Micromodules General Information for D1 D2 and C Packaging
File Size	276.09K / 13 Page	View it Online	Download Datasheet

				Sanyo Semicon Device
Part No.	LA4440
OCR Text	... foreign matter such as cutting particles shall exist between heat sink and radiator fin. When applying grease on the junction surface, it must be applied uniformly on the whole surface. 5. IC lead pins are soldered to the printed circuit b...
Description	6W 2-Channel / Bridge 19W typ Power Amplifier 6W 2-Channel, Bridge 19W typ Power Amplifier From old datasheet system
File Size	466.26K / 13 Page	View it Online	Download Datasheet

				Sanyo Electric Co.,Ltd. Sanyo Semicon Device
Part No.	LA4445 1489
OCR Text	... foreign matter such as cutting particles shall exist between heat sink and radiator fin. When applying grease on the junction surface, it must be applied uniformly on the whole surface. 5. IC lead pins are soldered to the printed circuit b...
Description	From old datasheet system 5.5W 2-Channel AF Power Amplifier
File Size	209.91K / 7 Page	View it Online	Download Datasheet

				NXP Semiconductors Philips Semiconductors
Part No.	SAA7214
OCR Text	...te (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for ...
Description	Transport MPEG2 source decoder
File Size	67.26K / 12 Page	View it Online	Download Datasheet

				NXP Semiconductors PHILIPS[Philips Semiconductors]
Part No.	TDA7040T TDA7040
OCR Text	...te (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; f...
Description	Low voltage PLL stereo decoder
File Size	112.64K / 11 Page	View it Online	Download Datasheet

				NXP Semiconductors PHILIPS[Philips Semiconductors]
Part No.	TDA8754 TDA8754H
OCR Text	...te (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for ...
Description	Triple high speed ADC for LCD drive
File Size	76.97K / 8 Page	View it Online	Download Datasheet

				NXP Semiconductors PHILIPS[Philips Semiconductors]
Part No.	BGF1901-10
OCR Text	...t and free from burrs and loose particles. We recommend a flatness for the mounting area of between 50 m concave and 50 m convex. The 50 m concave value is to ensure optimal thermal behaviour, while the 50 m convex value is intended to limi...
Description	GSM1900 EDGE power module
File Size	89.48K / 11 Page	View it Online	Download Datasheet

				PHILIPS[Philips Semiconductors] NXP Semiconductors N.V.
Part No.	TDA7050T TDA7050T/N3 TDA7050T/N3/S6
OCR Text	...te (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; f...
Description	TDA7050T; Low voltage mono/stereo power amplifier Low Voltage Mono/Stereo Power Amplifier(低压单声立体声功率放大器) 0.075 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO8
File Size	47.19K / 9 Page	View it Online	Download Datasheet

				PHILIPS[Philips Semiconductors] NXP Semiconductors
Part No.	74HC1G04 74HCT1G04 74HC1G04GW 74HC1G04GV 74HCT1G04GV 74HCT1G04GW
OCR Text	...te (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for ...
Description	74HC1G04; 74HCT1G04; Inverter
File Size	68.07K / 16 Page	View it Online	Download Datasheet

				International Rectifier
Part No.	IRPT1065A
OCR Text	...65A power module. 2. Remove all particles and grit from the heat sink and power substrate. 3. Spread a .004" to .005" layer of silicone grease on the heat sink, covering the entire area that the power substrate will occupy. Recommended heat...
Description	Power Module for 1 hp Motor Drives
File Size	193.02K / 12 Page	View it Online	Download Datasheet

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