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  XG8V-0541 Datasheet PDF File

For XG8V-0541 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    54132-3562 0541323562

Molex Electronics Ltd.
Part No. 54132-3562 0541323562
Description 0.50mm (.020) Pitch FFC/FPC Connector, Right Angle, SMT, ZIF, Bottom Contact Style, 35 Circuits, 0.1μm (4μ) Gold (Au) Contact Plating
File Size 447.96K  /  6 Page

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Amphenol Communications Solutions
Part No. 10080054-151LF
Description Quickie Header, Wire to Board Connector, Double Row, 34 Positions, Press-Fit Eject Latch Header 2.54 mm 0.76 um (30 u\\.) Gold or GXT™ Mating Plating.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    0505417225 50541-7225

Molex Electronics Ltd.
Part No. 0505417225 50541-7225
Description Ring Tongue Terminal for 1/0 AWG, Closed Uninsulated Brazed Barrel, Stud Size M10,Oxygen-Free Copper, Length 49.70mm (1.957)
File Size 93.04K  /  2 Page

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Amphenol Communications Solutions
Part No. 10080054-199LF
Description Quickie Header, Wire to Board Connector, Double Row, 50 Positions, Press-Fit Eject Latch Header 2.54 mm 0.76 um (30 u\\.) Gold or GXT™ Mating Plating.
Tech specs 　 　

Official Product Page

    0705410006 70541-0006

Molex Electronics Ltd.
Part No. 0705410006 70541-0006
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, withBeveled Plastic Peg, 7 Circuits, Tin (Sn) Plating
File Size 190.19K  /  4 Page

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Amphenol Communications Solutions
Part No. 10136647-054132LF
Description Minitek® Pwr 4.2, Single Row, Vertical Through Hole Header, LCP, 30u\\ Gold (Tin on Tails) plating, Natural Color, 5 Positions, GW Compatible, with out Posts, Tray packing.
Tech specs 　 　

Official Product Page

    54132-3862 0541323862

Molex Electronics Ltd.
Part No. 54132-3862 0541323862
Description 0.50mm (.020) Pitch FFC/FPC Connector, Right Angle, SMT, ZIF, Bottom Contact Style, 38 Circuits, 0.1μm (4μ) Gold (Au) Contact Plating
File Size 447.93K  /  6 Page

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Amphenol Communications Solutions
Part No. 10080054-182LF
Description Quickie Header, Wire to Board Connector, Double Row, 44 Positions, Press-Fit Eject Latch Header 2.54 mm 0.76 um (30 u\\.) Gold or GXT™ Mating Plating.
Tech specs 　 　

Official Product Page

    70541-9036 0705419036

Molex Electronics Ltd.
Part No. 70541-9036 0705419036
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, with Straight Plastic Peg, 2
File Size 155.96K  /  4 Page

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Amphenol Communications Solutions
Part No. 10080054-122LF
Description Quickie Header, Wire to Board Connector, Double Row, 26 Positions, Press-Fit Eject Latch Header 2.54 mm 0.76 um (30 u\\.) Gold or GXT™ Mating Plating.
Tech specs 　 　

Official Product Page

    0705419039 70541-9039

Molex Electronics Ltd.
Part No. 0705419039 70541-9039
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, withStraight Plastic Peg, 5 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC
File Size 155.96K  /  4 Page

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Amphenol Communications Solutions
Part No. 10080054-133LF
Description Quickie Header, Wire to Board Connector, Double Row, 30 Positions, Press-Fit Eject Latch Header 2.54 mm 0.76 um (30 u\\.) Gold or GXT™ Mating Plating.
Tech specs 　 　

Official Product Page

    0541043396

Molex Electronics Ltd.
Part No. 0541043396
Description 0.5 FPC CONN. ZIF SMT R/A UPPER CONTACT SEPARATED GOLD PLATING
File Size 340.30K  /  4 Page

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Amphenol Communications Solutions
Part No. 54112-120541400LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 54 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    0541043096

Molex Electronics Ltd.
Part No. 0541043096
Description 0.5 FPC CONN ASSY ZIF SMT RA(BTM CONT) E/O -LEAD FREE-
File Size 411.73K  /  4 Page

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Amphenol Communications Solutions
Part No. 68705-417HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 17 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs 　 　

Official Product Page

    0541020504 54102-0504

Molex Electronics Ltd.
Part No. 0541020504 54102-0504
Description 0.50mm (.020) Pitch SlimStack Receptacle, Surface Mount, Dual Row, Vertical2.50mm (.098) Stacking Height, Gold Plating with Nickel Barrier, 50 Circuits
File Size 327.40K  /  5 Page

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Amphenol Communications Solutions
Part No. 68705-412HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 12 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs 　 　

Official Product Page

    0541045031

Molex Electronics Ltd.
Part No. 0541045031
Description 0.50mm (.020) Pitch FFC/FPC Connector, Right Angle, SMT, ZIF, Top Contact Style50 Circuits, Lead-free, 0.1μm (4Âμ) Gold (Au) Plating
File Size 337.26K  /  6 Page

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Amphenol Communications Solutions
Part No. 10136647-054121LF
Description Minitek® Pwr 4.2, Single Row, Vertical Through Hole Header, Nylon 66, 30u\\ Gold (Tin on Tails) plating, Natural Color, 5 Positions, Non GW Compatible, with Posts, Tray packing.
Tech specs 　 　

Official Product Page

For XG8V-0541 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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