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  43045-0826 Datasheet PDF File

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    43045-2412

Molex Electronics Ltd.
Part No. 43045-2412
Description
File Size 166.52K  /  3 Page

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Amphenol Communications Solutions
Part No. 10093084-3045HFLF
Description QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, Halogen free
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    43045-2411

Molex Electronics Ltd.
Part No. 43045-2411
Description
File Size 180.51K  /  3 Page

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Amphenol Communications Solutions
Part No. 10093084-3045LF
Description QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, non-halogen free
Tech specs 　 　

Official Product Page

    43045-1025

Molex Electronics Ltd.
Part No. 43045-1025
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Vertical, with Press-fit Metal Retention Clip, 10 Circuits
File Size 182.53K  /  3 Page

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Renesas Electronics Corporation
Part No. M30826MH-XXXGP
Description 32-bit Microcomputers (Non Promotion), , /
Tech specs 　 　

Official Product Page

    43045-0420

Molex Electronics Ltd.
Part No. 43045-0420
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Vertical, with Solder Tab, 4 Circuits
File Size 175.81K  /  3 Page

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Amphenol Communications Solutions
Part No. 54112-808260900LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 26 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    43045-1810

Molex Electronics Ltd.
Part No. 43045-1810
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Solder Tab, 18 Circuits
File Size 180.51K  /  3 Page

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Amphenol Communications Solutions
Part No. 98414-G08-26ULF
Description Minitek® 2.00mm, Board to Board, Shrouded Vertical Header, Through Hole, Double Row, 26 Position ,2.00mm (0.079in) Pitch.
Tech specs 　 　

Official Product Page

    43045-1812

Molex Electronics Ltd.
Part No. 43045-1812
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 18 Circuits
File Size 166.51K  /  3 Page

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Amphenol Communications Solutions
Part No. 61083-082606LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 80 Positions.
Tech specs 　 　

Official Product Page

    43045-1818

Molex Electronics Ltd.
Part No. 43045-1818
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Vertical, with Solder Tab, 18 Circuits
File Size 175.78K  /  3 Page

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Amphenol Communications Solutions
Part No. 61083-082600LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 80 Positions.
Tech specs 　 　

Official Product Page

    43045-1813

Molex Electronics Ltd.
Part No. 43045-1813
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 18 Circuits
File Size 166.55K  /  3 Page

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Amphenol Communications Solutions
Part No. 61082-082600LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 80 Positions.
Tech specs 　 　

Official Product Page

    43045-1817

Molex Electronics Ltd.
Part No. 43045-1817
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Vertical, with Press-fit Metal Retention Clip, 18 Circuits
File Size 174.07K  /  3 Page

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Amphenol Communications Solutions
Part No. 61082-082602LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 80 Positions.
Tech specs 　 　

Official Product Page

    43045-1811

Molex Electronics Ltd.
Part No. 43045-1811
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Solder Tab, 18 Circuits
File Size 180.51K  /  3 Page

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Amphenol Communications Solutions
Part No. 10082627-404HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 4 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

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