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  5608-AZZDFNL Datasheet PDF File

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    Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. K9S5608V0A-SSB0 K9S5608V0A
Description 32M x 8Bit SmartMedia Card Data Sheet
32M x 8 Bit SmartMediaTM Card
File Size 344.88K  /  26 Page

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Amphenol Communications Solutions
Part No. 10136656-0821LF
Description Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, Gold Flash plating, 8 Positions, Black Color, GW Compatible LCP, Tray packing.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    K4S560832B K4S560832B-TC_L1H K4S560832B-TC_L1L K4S560832B-TC_L75 K4S560832B-TC/L75 K4S560832B-TC/L1L K4S560832B-TC/L1H

Samsung Electronic
SAMSUNG[Samsung semiconductor]
SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K4S560832B K4S560832B-TC_L1H K4S560832B-TC_L1L K4S560832B-TC_L75 K4S560832B-TC/L75 K4S560832B-TC/L1L K4S560832B-TC/L1H
Description 256Mbit SDRAM 8M x 8bit x 4 Banks Synchronous DRAM LVTTL
File Size 130.10K  /  11 Page

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Amphenol Communications Solutions
Part No. 10136656-0811LF
Description Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, Tin plating, 8 Positions, Black Color, GW Compatible LCP, Tray packing.
Tech specs 　 　

Official Product Page

   
Part No. K4H560838E-NLB3
Description 32M X 8 DDR DRAM, 0.7 ns, PDSO54
File Size 213.06K  /  24 Page

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Amphenol Communications Solutions
Part No. 75160-156-08LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,8 position, 2.54mm pitch
Tech specs 　 　

Official Product Page

    K4S560832D K4S560832D-TC_L1H K4S560832D-TC_L1L K4S560832D-TC_L75 K4S560832D-TC_L7C K4S560832D-TC/L1H K4S560832D-TC/L1L K

Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. K4S560832D K4S560832D-TC_L1H K4S560832D-TC_L1L K4S560832D-TC_L75 K4S560832D-TC_L7C K4S560832D-TC/L1H K4S560832D-TC/L1L K4S560832D-TC/L75 K4S560832D-TC/L7C
Description 256Mbit SDRAM 8M x 8bit x 4 Banks Synchronous DRAM LVTTL
File Size 116.54K  /  11 Page

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Amphenol Communications Solutions
Part No. 10136656-0812LF
Description Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, Tin plating, 8 Positions, Black Color, Non GW Compatible LCP, Tray packing.
Tech specs 　 　

Official Product Page

    K4S560832A K4S560832A-TC_L1H K4S560832A-TC_L1L K4S560832A-TC_L75 K4S560832A-TC_L80 K4S560832A-TC/L80 K4S560832A-TC/L1H K

SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. K4S560832A K4S560832A-TC_L1H K4S560832A-TC_L1L K4S560832A-TC_L75 K4S560832A-TC_L80 K4S560832A-TC/L80 K4S560832A-TC/L1H K4S560832A-TC/L1L K4S560832A-TC/L75
Description 256Mbit SDRAM 8M x 8bit x 4 Banks Synchronous DRAM LVTTL
IC,SDRAM,4X8MX8,CMOS,TSOP,54PIN,PLASTIC
File Size 125.57K  /  10 Page

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Amphenol Communications Solutions
Part No. 10136656-0832NLF
Description Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, 15u\\ Gold (Tin on Tails) plating, 8 Positions, Natural Color, Non GW Compatible LCP, Tray packing.
Tech specs 　 　

Official Product Page

    K4H560838E-GCCC K4H560838E-GCC4

Samsung semiconductor
Part No. K4H560838E-GCCC K4H560838E-GCC4
Description    256Mb E-die DDR 400 SDRAM Specification 60Ball FBGA (x4/x8)
File Size 198.99K  /  18 Page

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Amphenol Communications Solutions
Part No. 10136656-0842LF
Description Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, 30u\\ Gold (Tin on Tails) plating, 8 Positions, Black Color, Non GW Compatible LCP, Tray packing.
Tech specs 　 　

Official Product Page

    SMK CORP
Part No. CFP5626-0101 CFP5622-0101 CFP5628-0101 P5634-0101 P5631-0101 P5608-0101
Description 26 CONTACT(S), FEMALE, STRAIGHT FFC/FPC CONNECTOR, SURFACE MOUNT
22 CONTACT(S), FEMALE, STRAIGHT FFC/FPC CONNECTOR, SURFACE MOUNT
28 CONTACT(S), FEMALE, STRAIGHT FFC/FPC CONNECTOR, SURFACE MOUNT
34 CONTACT(S), FEMALE, STRAIGHT FFC/FPC CONNECTOR, SURFACE MOUNT
31 CONTACT(S), FEMALE, STRAIGHT FFC/FPC CONNECTOR, SURFACE MOUNT
File Size 35.98K  /  1 Page

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Amphenol Communications Solutions
Part No. 10136656-0822LF
Description Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, Gold Flash plating, 8 Positions, Black Color, Non GW Compatible LCP, Tray packing.
Tech specs 　 　

Official Product Page

   
Part No. K4H560838E-VCB00
Description 32M X 8 DDR DRAM, 0.75 ns, PDSO54
File Size 356.95K  /  24 Page

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Amphenol Communications Solutions
Part No. 10136656-0832LF
Description Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, 15u\\ Gold (Tin on Tails) plating, 8 Positions, Black Color, Non GW Compatible LCP, Tray packing.
Tech specs 　 　

Official Product Page

   
Part No. K4C560838F-TCDA0
Description
File Size 770.14K  /  41 Page

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Amphenol Communications Solutions
Part No. 10136656-0842NLF
Description Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, 30u\\ Gold (Tin on Tails) plating, 8 Positions, Natural Color, Non GW Compatible LCP, Tray packing.
Tech specs 　 　

Official Product Page

    SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K9F5608U0A-YCB0 K9F5608U0A-YIB0
Description TV 16C 16#16 PIN RECP
TV 79C 79#22D PIN RECP
File Size 613.64K  /  29 Page

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Amphenol Communications Solutions
Part No. 10136656-0811NLF
Description Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, Tin plating, 8 Positions, Natural Color, GW Compatible LCP, Tray packing.
Tech specs 　 　

Official Product Page

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