| |
|
 |
Texas Instruments |
| Part No. |
HPA00782DRLR
|
| Description |
Low-Capacitance 4-Channel +/-15-kV ESD Protection Array for High-Speed Data Interfaces 6-SOT-5X3 -40 to 85
|
| Tech specs |
|
|
Get Free Sample |
Official Product Page
|
| |
|
|
Molex Electronics Ltd.
|
| Part No. |
14-45-1802 A-70475-0421
|
| Description |
2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 28, 3.81μm (150μ) Tin (Sn), 2 Circuits
2.54mm (.100) Pitch SL?/a> Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 28, 3.81μm (150μ) Tin (Sn), 2 Circuits
|
| File Size |
150.54K /
3 Page |
 View
it Online |
Download Datasheet
|
| |
|
|
Coilcraft Inc |
| Part No. |
RFB0807-821L
|
| Description |
General Purpose Inductor, 820uH, 10%, 1 Element, Ferrite-Core, ROHS COMPLIANT
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Molex Electronics Ltd.
|
| Part No. |
14-44-1615 A-70475-0784
|
| Description |
2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 26, 0.38μm (15μ) Gold (Au), 15 Circuits
2.54mm (.100) Pitch SL?/a> Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 26, 0.38μm (15μ) Gold (Au), 15 Circuits
|
| File Size |
148.30K /
2 Page |
View
it Online |
Download Datasheet |
| |
|
|
Coilcraft Inc |
| Part No. |
RFB0807-822L
|
| Description |
General Purpose Inductor, 8200uH, 10%, 1 Element, Ferrite-Core, ROHS COMPLIANT
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Coilcraft Inc |
| Part No. |
RFB0807-820L
|
| Description |
General Purpose Inductor, 82uH, 10%, 1 Element, Ferrite-Core, ROHS COMPLIANT
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
10078239-10003LF
|
| Description |
DDR3 Memory Module Sockets, Storage and Server System, Very low profile (VLP) Through Hole, 240 Position Memory Socket.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
10078239-10002LF
|
| Description |
DDR3 Memory Module Sockets, Storage and Server System, Very low profile (VLP) Through Hole, 240 Position Memory Socket.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Molex Electronics Ltd.
|
| Part No. |
14-45-0605 70475-0249 A-70475-0249
|
| Description |
2.54mm (.100) Pitch SL?/a> Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 26, 3.81μm (150μ) Tin (Sn), 5 Circuits
2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 26, 3.81μm (150μ) Tin (Sn), 5 Circuits
|
| File Size |
152.68K /
3 Page |
View
it Online |
Download Datasheet |
| |
|
|
Amphenol Communications Solutions |
| Part No. |
10078239-11101LF
|
| Description |
DDR3 Memory Module Sockets, Storage and Server System, Very low profile (VLP) Through Hole, 240 Position Memory Socket.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Molex Electronics Ltd.
|
| Part No. |
14-45-0606 70475-0250 A-70475-0250
|
| Description |
2.54mm (.100) Pitch SL?/a> Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 26, 3.81μm (150μ) Tin (Sn), 6 Circuits
2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 26, 3.81μm (150μ) Tin (Sn), 6 Circuits
|
| File Size |
151.55K /
2 Page |
View
it Online |
Download Datasheet |
| |
|
|
Amphenol Communications Solutions |
| Part No. |
10078239-11123LF
|
| Description |
DDR3 UDIMM, Storage and Server Connector, Very Low Profile, Vertical, Through Hole, 240 Position, 1.00mm (0.039in) Pitch
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Molex Electronics Ltd.
|
| Part No. |
14-45-0603 A-70475-0247
|
| Description |
2.54mm (.100) Pitch SL?/a> Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 26, 3.81μm (150μ) Tin (Sn), 3 Circuits
2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 26, 3.81μm (150μ) Tin (Sn), 3 Circuits
|
| File Size |
152.67K /
3 Page |
View
it Online |
Download Datasheet |
| |
|
|
Amphenol Communications Solutions |
| Part No. |
10078239-11104LF
|
| Description |
DDR3 Memory Module Sockets, Storage and Server System, Very low profile (VLP) Through Hole, 240 Position Memory Socket.
|
| Tech specs |
|
|
|
Official Product Page
|
|
Bom2Buy.com
Price and Availability
|
