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  70553-0114 Datasheet PDF File

For 70553-0114 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    1-201144-8 1-201144-1 201144-3 201144-5 201144-6 201144-7

Tyco Electronics
Part No. 1-201144-8 1-201144-1 201144-3 201144-5 201144-6 201144-7
Description SOCKET MINIATURE SERIES

File Size 107.38K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114831-10114LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 14 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    SCHURTER AG
Part No. DD11.0114.1110 DD11.0113.1110
Description DD11 POWER ENTRY MODUL 8/10A, 250VAC, MALE, MAINS POWER CONNECTOR, SOLDER

File Size 532.75K  /  3 Page

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Amphenol Communications Solutions

Part No. 10114828-10114LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 14 Positions
Tech specs    

Official Product Page

    SD-120114-068

Molex Electronics Ltd.
Part No. SD-120114-068
Description Micro-Change Molded Junction Box, Top Mount, 8 Ports, 2(OI) per port, LEDs for PNP sensors

File Size 140.26K  /  2 Page

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Amphenol Communications Solutions

Part No. 10114829-10114LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 14 Positions
Tech specs    

Official Product Page

    SD-120114-075

Molex Electronics Ltd.
Part No. SD-120114-075
Description Micro-Change Molded Junction Box, Top Mount, 8 Ports, 2(IO) per port, LEDs for PNP sensors, with Integral

File Size 133.45K  /  2 Page

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Amphenol Communications Solutions

Part No. 10114830-10114LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 14 Positions
Tech specs    

Official Product Page

    SD-120114-077

Molex Electronics Ltd.
Part No. SD-120114-077
Description Micro-Change Molded Junction Box, Top Mount, 6 Ports, LEDs for PNP sensors, with Integral Mini-Change

File Size 111.91K  /  2 Page

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Amphenol Communications Solutions

Part No. 10114508-D0J-20DLF
Description XCede® High Speed Backplane Connectors, Left polarizing guide module with key feature.
Tech specs    

Official Product Page

    SD-120114-082

Molex Electronics Ltd.
Part No. SD-120114-082
Description Micro-Change Molded Junction Box, Top Mount, 8 Ports, LEDs for PNP sensors, with Mini-Change

File Size 114.78K  /  2 Page

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Amphenol Communications Solutions

Part No. 10114828-10102LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 2 Positions
Tech specs    

Official Product Page

   
Part No. 74442-0114 74442-0124
Description 88 CONTACT(S), FEMALE, RIGHT ANGLE TELECOM AND DATACOM CONNECTOR, SOLDER, JACK
96 CONTACT(S), FEMALE, RIGHT ANGLE TELECOM AND DATACOM CONNECTOR, SOLDER, JACK

File Size 449.55K  /  5 Page

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Amphenol Communications Solutions

Part No. 10114868-L0J-10DLF
Description XCede® High Speed Backplane Connectors, 3 wall left header.
Tech specs    

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    50-65-0114 70104-0013

Molex Electronics Ltd.
Part No. 50-65-0114 70104-0013
Description 2.54mm (.100) Pitch, SL Single Row Wire-to-Wire Panel Mount, 14 Circuits
2.54mm (.100") Pitch, SL垄芒 Single Row Wire-to-Wire Panel Mount, 14 Circuits

File Size 145.13K  /  3 Page

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Amphenol Communications Solutions

Part No. 10114508-00J-20DLF
Description XCede® High Speed Backplane Connectors, 2 wall header.
Tech specs    

Official Product Page

    SW65-0114-TB SW65-0114TR SW65-0114

Tyco Electronics
Part No. SW65-0114-TB SW65-0114TR SW65-0114
Description 吸收砷化镓单刀双掷开关与ASIC驱动器,直流- 3.0吉赫
GaAs SPDT Absorptive Switch with ASIC Driver, DC - 3.0 GHz

File Size 210.95K  /  2 Page

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Amphenol Communications Solutions

Part No. 10114492-008LF
Description HPCE R/A REC 32P24S
Tech specs    

Official Product Page

    0011-40-4204 001140-4204

Molex Electronics Ltd.
Part No. 0011-40-4204 001140-4204
Description Conductor Anvil

File Size 15.98K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114868-10J-10DLF
Description XCede® High Speed Backplane Connectors, 4 wall header.
Tech specs    

Official Product Page

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