|
|
|
Amphenol Communications Solutions |
Part No. |
87900-158HLF
|
Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 58 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
|
Molex Electronics Ltd.
|
Part No. |
15-80-0063 0015800063
|
Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plati Molex Electronics Ltd.
|
File Size |
1,218.42K /
7 Page |
View
it Online |
Download Datasheet |
|
Bom2Buy.com
Price and Availability
|