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Integrated Device Techn...
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| Part No. |
72255LA10PFG8 72255LA10PFGI8 72255LA10TFG8
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| OCR Text |
...rectly to the data output lines after three transitions of the rclk signal. a ren does not have to be asserted for accessing the first word. however, subsequent words written to the fifo do require a low on ren for access. the state o... |
| Description |
CMOS SuperSync FIFO
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| File Size |
480.40K /
27 Page |
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FENGJUI TECHNOLOGY CO.,...
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| Part No. |
CM7060F-102 CM7060F-132 CM7060F-701
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| OCR Text |
...efects. 3. terminal strength: after soldering. between copper plat e and terminals of coil. push in two directions of x.y withstanding at below conditions. terminal should not peel off. (refer to figure at right) 5. 0n 60 sec. 4. ... |
| Description |
EMI SOLOTION PRODUCTS-RoHS
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| File Size |
248.93K /
3 Page |
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it Online |
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STANLEY ELECTRIC CO.,LT...
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| Part No. |
VTAN1111C-TR
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| OCR Text |
...esin are not stable immediately after soldering ( when they are not at room temperature), any mechanical stress may cause damage to the product. please avoid such stress after soldering, especially stacking of the boards which may cau... |
| Description |
Equivalent to JEDEC MSL3
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| File Size |
514.80K /
22 Page |
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it Online |
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StarHope
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| Part No. |
GDT-SPX
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| OCR Text |
...d specification cold resistance after -403 (1000hrs) / room temp.,normal humidity(4 hrs) cycle, measure the properties. within standard mentioned in initial characteristics. within standard mentioned in initial characteristics. within stan... |
| Description |
Gas Discharge Tube SPX Series
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| File Size |
41.26K /
3 Page |
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it Online |
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