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For copper-free Found Datasheets File :: 23827    Search Time::2.671ms    
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    BY228

Philips Semiconductors
Part No. BY228
OCR Text ...35 10 50 25 7 50 3 cm2 copper 3 cm2 copper 30 2 3 MGA200 10 MGA204 25.4 Dimensions in mm. Dimensions in mm. Fig.5 Fig.4 Device mounted on a printed-circuit board. Mounting with additional printed circuit bo...
Description Damper diode

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    BY448

Philips Semiconductors
Part No. BY448
OCR Text ...35 10 50 25 7 50 3 cm2 copper 3 cm2 copper 30 2 3 MGA200 10 MGA204 25.4 Dimensions in mm. Dimensions in mm. Fig.5 Fig.4 Device mounted on a printed-circuit board. Mounting with additional printed circuit bo...
Description Damper diode

File Size 43.16K  /  7 Page

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    BYD11 BYD11D BYD11G BYD11J BYD11K BYD11M

NXP Semiconductors
PHILIPS[Philips Semiconductors]
Part No. BYD11 BYD11D BYD11G BYD11J BYD11K BYD11M
OCR Text ...ard, 1.5 mm thick; thickness of copper 40 m, see Fig.9. For more information please refer to the "General Part of associated Handbook". 1996 Sep 26 3 Not recommended for new designs PARAMETER thermal resistance from junction to tie-point th...
Description Controlled avalanche rectifiers

File Size 42.69K  /  7 Page

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    BYD13 BYD13D BYD13G BYD13J BYD13K BYD13M BYD13_1 BYD13M/A52R

PHILIPS[Philips Semiconductors]
NXP Semiconductors
Part No. BYD13 BYD13D BYD13G BYD13J BYD13K BYD13M BYD13_1 BYD13M/A52R
OCR Text ...ard, 1.5 mm thick; thickness of copper 40 m, see Fig.9. For more information please refer to the "General Part of associated Handbook". PARAMETER thermal resistance from junction to tie-point thermal resistance from junction to ambient note...
Description DIODE CONTROLLED AVALANCHE
Controlled avalanche rectifiers
From old datasheet system

File Size 39.14K  /  7 Page

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    BYD143

NXP Semiconductors
PHILIPS[Philips Semiconductors]
Part No. BYD143
OCR Text ...ard, 1.5 mm thick; thickness of copper 40 m, see Fig.7. For more information please refer to the "General part of the associated handbook". 1999 Feb 10 3 Philips Semiconductors Product specification Ultra fast low-loss rectif...
Description Ultra fast low-loss rectifier

File Size 65.07K  /  8 Page

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    BYD147 BYD147_3

NXP Semiconductors
PHILIPS[Philips Semiconductors]
Part No. BYD147 BYD147_3
OCR Text ...ard, 1.5 mm thick; thickness of copper 40 m, see Fig.7. For more information please refer to the "General part of the associated handbook". 1999 Nov 11 3 Philips Semiconductors Product specification Ultra fast low-loss rectif...
Description From old datasheet system
Ultra fast low-loss rectifier

File Size 48.52K  /  8 Page

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    BYD163

NXP Semiconductors
PHILIPS[Philips Semiconductors]
Part No. BYD163
OCR Text ...ard, 1.5 mm thick; thickness of copper 40 m, see Fig.7. For more information please refer to the "General Part of associated Handbook". PARAMETER thermal resistance from junction to tie-point thermal resistance from junction to ambient note...
Description Ultra fast low-loss rectifier

File Size 65.27K  /  8 Page

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    BYD167 BYD167_3 BYD127

NXP Semiconductors
PHILIPS[Philips Semiconductors]
Part No. BYD167 BYD167_3 BYD127
OCR Text ...ard, 1.5 mm thick; thickness of copper 40 m, see Fig.7. For more information please refer to the "General Part of associated Handbook". 1999 Nov 11 3 Philips Semiconductors Product specification Ultra fast low-loss rectifier ...
Description From old datasheet system
Ultra fast low-loss rectifier

File Size 48.49K  /  8 Page

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    BYD17 BYD17D BYD17G BYD17J BYD17K BYD17M BYD17SERIES

NXP Semiconductors
PHILIPS[Philips Semiconductors]
Fairchild Semiconductor, Corp.
Part No. BYD17 BYD17D BYD17G BYD17J BYD17K BYD17M BYD17SERIES
OCR Text ...ard, 1.5 mm thick; thickness of copper 40 m, see Fig.9. For more information please refer to the "General Part of associated Handbook". PARAMETER thermal resistance from junction to tie-point thermal resistance from junction to ambient note...
Description General purpose controlled avalanche rectifiers(通用可控雪崩整流
LNB Supply and control voltage regulator 通用控制雪崩整流

File Size 54.08K  /  8 Page

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    BYD32 BYD32D BYD32G BYD32J BYD32SERIES

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PHILIPS[Philips Semiconductors]
NXP Semiconductors N.V.
Part No. BYD32 BYD32D BYD32G BYD32J BYD32SERIES
OCR Text ...ard, 1.5 mm thick; thickness of copper layer 40 m, pitch 5 mm; see Fig.6. 1998 Dec 03 3 Philips Semiconductors Preliminary specification Fast soft-recovery controlled avalanche rectifiers GRAPHICAL DATA MDA809 BYD32 seri...
Description Fast soft-recovery controlled avalanche rectifiers(快速软恢复控制的雪崩整流器) 0.76 A, 200 V, SILICON, SIGNAL DIODE

File Size 51.62K  /  8 Page

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For copper-free Found Datasheets File :: 23827    Search Time::2.671ms    
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