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FAIRCHILD[Fairchild Semiconductor]
Fairchild Semiconductor Corporation
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| Part No. |
RMPA39100
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| OCR Text |
...ding uses 3mils wide and 0.5mil thick gold ribbon with lengths as short as practical allowing for appropriate stress relief. The RF input and output bonds should be typically 12 mils long corresponding to a typical 2 mil gap between the chi... |
| Description |
37 - 40 GHz 1 Watt Power Amplifier MMIC
37-40 GHz 1 Watt Power Amplifier MMIC
DIODE SWITCHING DUAL-DUAL SERIES 240V 225mA-Io 350mW 50ns-trr SOT-26 3K/REEL
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| File Size |
464.86K /
10 Page |
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FAIRCHILD[Fairchild Semiconductor]
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| Part No. |
RMWB04001
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| OCR Text |
...ding uses 3mils wide and 0.5mil thick gold ribbon with lengths as short as practical allowing for appropriate stress relief. The RF input and output bonds should be typically 12 mils long corresponding to a typical 2 mil gap between the chi... |
| Description |
4 GHz Buffer Amplifier MMIC
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| File Size |
105.53K /
7 Page |
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it Online |
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FAIRCHILD[Fairchild Semiconductor]
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| Part No. |
RMWB11001
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| OCR Text |
...tive) 10,000pF 100pF 100pF 5mil Thick Alumina 50 5 mil Thick Alumina 50 Die-Attach 80Au/20Sn
RF Input
RF Output
100pF 2 mil Gap 10,000pF Vg (Negative)
100pF 3K L< 0.015" (4 Places) Vdet (Positive)
Notes: Use 0.003" by 0.0005"... |
| Description |
11 GHz Buffer Amplifier MMIC
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| File Size |
349.24K /
6 Page |
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it Online |
Download Datasheet |
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FUJITSU COMPONENT LTD
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| Part No. |
FCN-565P068-G/C-V4
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| OCR Text |
....047 in.) to 1.6 mm (0.063 in.) thick pc board) fcn-565p068-g/08-v4 (for 1.0 mm (0.039 in.) thick pc board) ? long-terminal models are also available. part number: fcn-565p068-g/13-v4 (4 mm (0.157 in.)) fcn-565p068-g/02-v4 (10 mm (0.394 in... |
| Description |
68 CONTACT(S), MALE, RIGHT ANGLE PCMCIA CONNECTOR, SOLDER, PLUG
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| File Size |
208.59K /
3 Page |
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it Online |
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FAIRCHILD[Fairchild Semiconductor]
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| Part No. |
RMWB12001
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| OCR Text |
...ng uses 3 mils wide and 0.5 mil thick gold ribbon with lengths as short as practical allowing for appropriate stress relief. The RF input and output bonds should be typically 0.012" long corresponding to a typical 2 mil gap between the chip... |
| Description |
12 GHz Buffer Amplifier MMIC
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| File Size |
195.44K /
6 Page |
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it Online |
Download Datasheet |
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FAIRCHILD[Fairchild Semiconductor]
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| Part No. |
RMWB24001
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| OCR Text |
...ng uses 3 mils wide and 0.5 mil thick gold ribbon with lengths as short as practical allowing for appropriate stress relief. The RF input and output bonds should be typically 0.012" long corresponding to a typical 2 mil gap between the chip... |
| Description |
24 GHz Buffer Amplifier MMIC
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| File Size |
91.67K /
7 Page |
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it Online |
Download Datasheet |
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PHOENIX CONTACT
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| Part No. |
0311126
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| OCR Text |
...l: copper, unperforated, 1.5 mm thick, height 15 mm, width 35 mm, length: 2 m ? ? din rail?-?ns 35/15-2,3 unperf 2000mm?-?1201798 din rail, material: steel, unperforated, 2.3 mm thick, height 15 mm, width 35 mm, length: 2 m ? ? din rail, un... |
| Description |
Component terminal block - URTK/SP - 0311126
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| File Size |
230.32K /
13 Page |
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it Online |
Download Datasheet |
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PHOENIX CONTACT
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| Part No. |
0311087
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| OCR Text |
...l: copper, unperforated, 1.5 mm thick, height 15 mm, width 35 mm, length: 2 m ? ? din rail?-?ns 35/15-2,3 unperf 2000mm?-?1201798 din rail, material: steel, unperforated, 2.3 mm thick, height 15 mm, width 35 mm, length: 2 m ? ? din rail, un... |
| Description |
Test disconnect terminal block - URTK/S - 0311087
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| File Size |
231.44K /
14 Page |
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it Online |
Download Datasheet |
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Price and Availability
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