4418 pdf Datasheet P8 Part Num --- IC-ON-LINE


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4418 Datasheet PDF File

For 4418 Found Datasheets File :: 103+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 |

					GSI[GSI Technology]
Part No.	GS864418E-200 GS864418E-200I GS864418E-133 GS864418E-133I GS864418E-150 GS864418E-150I GS864418E-166 GS864418E-166I GS864418E-225 GS864418E-225I GS864418E-250 GS864418E-250I GS864472C-250I GS864418 GS864418B GS864418B-133 GS864418B-133I GS864418B-150 GS864418B-150I GS864418B-166 GS864418B-166I GS864418B-200 GS864418B-200I GS864418B-225 GS864418B-225I GS864418B-250 GS864418B-250I GS864418E GS864436 GS864436B GS864436B-133 GS864436B-133I GS864436B-150 GS864436B-150I GS864436B-166 GS864436B-166I GS864436B-200 GS864436B-200I GS864436B-225 GS864436B-225I GS864436B-250 GS864436B-250I GS864436E GS864436E-133 GS864436E-133I GS864436E-150 GS864436E-150I GS864436E-166 GS864436E-166I GS864436E-200 GS864436E-200I GS864436E-225 GS864436E-225I GS864436E-250 GS864436E-250I GS864472 GS864472C GS864472C-133 GS864472C-133I GS864472C-150 GS864472C-150I GS864472C-166 GS864472C-166I GS864472C-200 GS864472C-200I GS864472C-225 GS864472C-225I GS864472C-250
Description	4M x 18, 2M x 36, 1M x 72 72Mb S/DCD Sync Burst SRAMs
File Size	833.68K / 41 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	75844-182-08LF
Description	BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

HUA FENG CIRCUIT

					Sunon, Inc. SAMSUNG SEMICONDUCTOR CO. LTD.
Part No.	K4R441869A K4R271669A-NMCG6 K4R271669A-NMCK7 K4R271669A-NMCK8 K4R441869A-NMCG6 K4R441869A-NMCK7 K4R441869A-NMCK8 K4R271669A-NBMCCG6
Description	256K x 16/18 bit x 216 Dependent Banks Direct RDRAMTM 256 × 16/18位2 16属银行直接RDRAMTM
File Size	4,066.36K / 64 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	131-4418-21H
Description	Paladin® 112Gb/s Backplane Connector, 4-Pair, 8 Column, Right End Wall, Backplane Module, 2.25mm Wipe, APP.
Tech specs				Official Product Page

					http:// SAMSUNG SEMICONDUCTOR CO. LTD.
Part No.	K4R271669B-NMCG6 K4R441869B-NMCG6 K4R441869B-NMCK7 K4R271669B-NMCK7 K4R271669B-NBMCCK8 K4R441869B-NCK7 K4R441869B-NCK8
Description	256K x 16/18 bit x 32s banks Direct RDRAMTM
File Size	309.32K / 20 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10122864-418002LF
Description	BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in) Pitch.
Tech specs				Official Product Page

					Renesas Electronics Corporation
Part No.	R1QLA4418RBG-25IB0 R1QLA4418RBG-25IA0 R1QLA4436RBG-25IB0 R1QLA4436RBG-15 R1QLA4436RBG-25IA0
Description	144-Mbit DDR?II SRAM 2-word Burst Architecture (2.0 Cycle Read latency) with ODT
File Size	942.71K / 31 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68764-418HLF
Description	BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angled Header, Through Hole, Single Row, 18 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					Renesas Electronics Corporation
Part No.	R1QPA4418RBG-33IB0 R1QPA4418RBG-30IA0 R1QPA4436RBG-30IA0 R1QPA4436RBG-33IB0
Description	144-Mbit QDR?II SRAM 2-word Burst Architecture (2.0 Cycle Read latency) with ODT
File Size	948.41K / 31 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	76384-418LF
Description	Dubox®2.54mm, Board to Board Connector, Shrouded Header, Single Row, Straight.
Tech specs				Official Product Page

					Renesas Electronics Corporation
Part No.	R1QDA4418RBG-18IA0 R1QDA4436RBG-20IB0
Description	144-Mbit QDR?II SRAM 4-word Burst Architecture (2.5 Cycle Read latency) with ODT 144-Mbit QDR?II SRAM 4-word Burst Architecture (2.5 Cycle Read latency) with ODT
File Size	954.94K / 31 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	131-4418-11H
Description	Paladin® 112Gb/s Backplane Connector, 4-Pair, 8 Column, Right End Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs				Official Product Page

					SAMSUNG[Samsung semiconductor] Samsung Electronic
Part No.	K4R271669A K4R441869A-NMCG6 K4R441869A-NMCK7 K4R441869A-NMCK8 K4R271669A-NMCK7 K4R271669A-NMCK8 K4R271669A-NBMCCG6 K4R441869A-N_MCK8 K4R271669A-N_MCK7 K4R271669A-N_MCK8 K4R441869A K4R441869A-N_MCG6 K4R441869A-N_MCK7 K4R271669AM-CG6 K4R271669AN-CK8 K4R271669AM-CK7
Description	256K x 16 x 32s dependent banks direct RDRAM. Access time: 45 ns, I/O freq. 711 MHz. 256K x 16 x 32s dependent banks direct RDRAM. Access time: 53.3 ns, I/O freq. 600 MHz. 256K x 16/18 bit x 2*16 Dependent Banks Direct RDRAMTM 256K x 16 x 32s dependent banks direct RDRAM. Access time: 45 ns, I/O freq. 800 MHz.
File Size	4,046.09K / 64 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68464-418HLF
Description	BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 18 Positions, 2.54 mm (0.100in) Pitch.
Tech specs				Official Product Page

					ETC MICRONAS[Micronas]
Part No.	MSP4428G MSP4408G MSP4448G MSP4458 MSP4458G MSPB4418G MSP4418G MSP44X8G
Description	Multistandard Sound Processor
File Size	657.44K / 85 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	93944-418HLF
Description	BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 18 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					Renesas Electronics Corporation
Part No.	R1QEA4418RBG-20IA0 R1QEA4436RBG-20IB0 R1QEA4436RBG-20IA0 R1QEA4418RBG-20IB0 R1QEA4418RBG-18IA0 R1QEA4418RBG-19IA0 R1QEA4418RBG-18IB0
Description	144-Mbit DDR?II SRAM 2-word Burst Architecture ( 2.5 Cycle Read latency ) with ODT
File Size	945.53K / 31 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68604-418HLF
Description	BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 18 Positions, 2.54 mm (0.100in) Pitch.
Tech specs				Official Product Page

					Samsung Electronic SAMSUNG[Samsung semiconductor]
Part No.	K4R441869B-NMCK7 K4R441869B-NMCK8 K4R271669B-NMCG6 K4R271669B-NMCK7 K4R271669B-NBMCCK8 K4R271669B-NCG6 K4R271669B-NCK7 K4R271669B-NCK8 K4R441869B-NCK8 K4R271669B K4R271669B-MCG6 K4R271669B-MCK7 K4R271669B-MCK8 K4R441869B-MCG6 K4R441869B-MCK7 K4R441869B-MCK8 K4R441869B-NCG6 K4R441869B-NCK7 K4R441869B-NMCG6 K4R271869B-MCK8 K4R271869B-NCG6
Description	256K x 18 x 32s banks direct RDRAM. Access time: 53.3 ns, I/O freq.: 600 MHz. 256K x 18 x 32s banks direct RDRAM. Access time: 45 ns, I/O freq.: 800 MHz. 256K x 16 x 32s banks direct RDRAM. Access time: 45 ns, I/O freq.: 711 MHz. K4R271669B:Direct RDRAMData Sheet 256K x 16/18 bit x 32s banks Direct RDRAMTM 256K x 16 x 32s banks direct RDRAM. Access time: 53.3 ns, I/O freq.: 600 MHz. 256K x 16 x 32s banks direct RDRAM. Access time: 45 ns, I/O freq.: 800 MHz.
File Size	304.91K / 20 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	92634-418HLF
Description	BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 18 Positions, 2.54 mm Pitch, Right Angle, 8.08 mm (0.318in) Mating, 8.08 mm (0.318in) Tail.
Tech specs				Official Product Page

For 4418 Found Datasheets File :: 103+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 |

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