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CML Innovative Technologies
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| Part No. |
433.25 433.375 4331.75 3302.5
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| OCR Text |
...or soldering, welding or other joining operations in the manufacture of the fuse. ?the lower height profile produces a flat surface for improved performance in pick-and-place operations and an alternate solution for height critical applic... |
| Description |
Dual/Triple Ultra-Low-Voltage SOT23 µP Supervisory Circuits
Fuse 保险
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| File Size |
44.83K /
1 Page |
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Digi International Inc.
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| Part No. |
X2-SE1-EC-A XK-SE1-EC-A
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...module also handles networking, joining, authentication and key establishment functions. connectport x2 gateways with the zigbee smart energy public profle provide interoperable ip-to-application connectivity. ? full certifcation as a... |
| Description |
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| File Size |
1,155.09K /
2 Page |
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Broadcom
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| Part No. |
BCM91160
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| OCR Text |
...sysetup push-button setup makes joining a wi-fi network fast and easy. open arm9 ? and linux os-based platform provides a foundation for oem/odm differentiation through unique features. details how to use broadcom?s two chip phone ... |
| Description |
Wi-Fi® Phone Reference Design
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| File Size |
314.98K /
2 Page |
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Broadcom Corp.
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| Part No. |
BCM5248
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| OCR Text |
....13 gigabit copper phy family, joining the bcm5404, bcm5414, bcm5421, bcm5421s, bcm5424, bcm5434, bcm5464, and bcm5464s. the 0.13m process is the optimal process that offers the best performance, lowest cost, and lowest power for gigabi... |
| Description |
10/100/1000BASE-T GIGABIT COPPER TRANSCEIVER
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| File Size |
185.71K /
2 Page |
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TVS二极- 瞬态电压抑
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| Part No. |
IP4234CZ6
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| OCR Text |
...w soldering wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. the wave soldering process is suitable for the following: ? through-hole components ? leaded or leadless... |
| Description |
Single USB 2.0 ESD protection to IEC 61000-4-2 level 4
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| File Size |
52.30K /
9 Page |
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Yageo, Corp.
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| Part No. |
06032E103Z8BP0D 08052E103Z9BP0D 06032E103Z8B30D 08052E103Z9B20D 06032E103Z8B20D 12062E103Z9B20D
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...n applied for 10 s to the line joining the terminations and in a plane parallel to the substrate no visible damage mounted in accordance with cecc 32 100, paragraph 4.4 no visible damage 4.9 bond strength of plating on end face... |
| Description |
CAPACITOR, CERAMIC, MULTILAYER, 25 V, Z5U, 0.01 uF, SURFACE MOUNT, 0603 CHIP, LEAD FREE
CAPACITOR, CERAMIC, MULTILAYER, 50 V, Z5U, 0.01 uF, SURFACE MOUNT, 0805 CHIP, LEAD FREE
CAPACITOR, CERAMIC, MULTILAYER, 50 V, Z5U, 0.01 uF, SURFACE MOUNT, 1206 CHIP, LEAD FREE
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| File Size |
128.25K /
10 Page |
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