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For particles Found Datasheets File :: 951    Search Time::0.969ms    
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    TDA6800 TDA6800T

NXP Semiconductors
Philips Semiconductors
Part No. TDA6800 TDA6800T
OCR Text ...te (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; f...
Description Video modulator circuit

File Size 49.59K  /  10 Page

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    74LVC1G00 74LVC1G00GW

Philips Semiconductors
Part No. 74LVC1G00 74LVC1G00GW
OCR Text ...te (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for ...
Description Single 2-input NAND gate

File Size 63.86K  /  12 Page

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    RA18H1213G RA18H1213G-01

Mitsubishi Electric, Corp.
MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. RA18H1213G RA18H1213G-01
OCR Text ...a heat sink that is not flat or particles between module and heat sink may cause the ceramic substrate in the module to crack by bending forces, either immediately when driving screws or later when thermal expansion forces are added). A the...
Description 1.24-1.30GHz 18W 12.5V, 3 Stage Amp. For MOBILE RADIO 1.24 - 1.30GHz 18W 12.5V阶段制造。对于移动通信

File Size 93.29K  /  9 Page

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    Philips
Part No. TDA1575T TDA1575T/V2
OCR Text ...te (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; f...
Description TDA1575T; FM front end circuit for CENELEC EN 55020 applications

File Size 174.10K  /  16 Page

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    TDA4820T

NXP Semiconductors
Philips Semiconductors
Part No. TDA4820T
OCR Text ...te (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; f...
Description Sync separation circuit for video applications

File Size 57.26K  /  10 Page

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    http://
HP[Agilent(Hewlett-Packard)]
Agilent (Hewlett-Packard)
Part No. HFBR-1506AM HFBR-2506AM HFBR-0541
OCR Text ...r often is sufficient to remove particles of dirt; methanol on a cotton swab also works well. Recommended Chemicals for Cleaning/Degreasing Alcohols: methyl, isopropyl, isobutyl. Aliphatics: hexane, heptane. Other: soap solution, naphtha. D...
Description Fiber Optic SMA Transmitters and Receivers for 16 MBd SERCOS Applications
HFBR-0541 · Evaluation Kit designed for SERCOS applications that operate up to 16 MBd
HFBR-1506AM · 16 MBd SERCOS Fiber Optic Transmitter
HFBR-2506AM · 16 MBd SERCOS Fiber Optic Receiver

File Size 177.66K  /  8 Page

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    RA07H4047M RA07H4047M-01 RA07H4047M-E01

Mitsubishi Electric Sem...
Mitsubishi Electric Corporation
MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. RA07H4047M RA07H4047M-01 RA07H4047M-E01
OCR Text ...a heat sink that is not flat or particles between module and heat sink may cause the ceramic substrate in the module to crack by bending forces, either immediately when driving screws or later when thermal expansion forces are added). A the...
Description    400-470MHz 7W 12.5V, 2 Stage Amp. For PORTABLE/ MOBILE RADIO
400-470MHz 7W 12.5V/ 2 Stage Amp. For PORTABLE/ MOBILE RADIO
400-470MHz 7W 12.5V 2 Stage Amp. For PORTABLE/ MOBILE RADIO

File Size 67.47K  /  9 Page

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    RA07H4452M RA07H4452M-01 RA07H4452M-E01

Mitsubishi Electric Semicon...
MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. RA07H4452M RA07H4452M-01 RA07H4452M-E01
OCR Text ...a heat sink that is not flat or particles between module and heat sink may cause the ceramic substrate in the module to crack by bending forces, either immediately when driving screws or later when thermal expansion forces are added). A the...
Description 440-520MHz 7W 12.5V PORTABLE/ MOBILE RADIO

File Size 63.28K  /  9 Page

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    RA07N4452M RA07N4452M-01 RA07N4452M-E01

Mitsubishi Electric Corporation
MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. RA07N4452M RA07N4452M-01 RA07N4452M-E01
OCR Text ...a heat sink that is not flat or particles between module and heat sink may cause the ceramic substrate in the module to crack by bending forces, either immediately when driving screws or later when thermal expansion forces are added). A the...
Description 440-520MHz 7.5W 9.6V PORTABLE RADIO

File Size 60.69K  /  9 Page

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