|
|
 |
Rochester Electronics LLC |
Part No. |
4164-15FGS/BZA
|
Description |
4164 - DRAM, 64K X 1, 3-STATE OUTPUTS, 150 NS ACCESS TIME - Dual marked (8201006ZA)
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |
Rochester Electronics LLC |
Part No. |
4164-15JDS/BEA
|
Description |
4164 - DRAM, 64K X 1, 3-STATE OUTPUTS, 150 NS ACCESS TIME - Dual marked (8201006EA)
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |
Rochester Electronics LLC |
Part No. |
4164-12JDS/BEA
|
Description |
4164 - DRAM, 64K X 1, 3-STATE OUTPUTS, 120 NS ACCESS TIME - Dual marked (8201008EA)
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |

Molex Electronics Ltd.
|
Part No. |
0905721641 90572-1641
|
Description |
2.54mm (.100) Pitch QF-50?/a> Header, Right Angle, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 64 Circuits, 0.1 μm Gold (Au) 2.54mm (.100) Pitch QF-50 Header, Right Angle, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 64 Circuits, 0.1 μm Gold (Au)
|
File Size |
215.87K /
4 Page |
View
it Online |
Download Datasheet
|
|
|
 |
Amphenol Communications Solutions |
Part No. |
68016-412HLF
|
Description |
BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Single Row, 12 Positions, 2.54 mm (0.100) Pitch.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |
Amphenol Communications Solutions |
Part No. |
10116413-150001HLF
|
Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 50 Positions, 2.54mm (0.100in) Pitch.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |
Amphenol Communications Solutions |
Part No. |
68016-418HLF
|
Description |
BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Single Row, 18 Positions, 2.54 mm (0.100) Pitch.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |
Amphenol Communications Solutions |
Part No. |
87916-413HLF
|
Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 13 Positions, 2.54mm Pitch, Vertical, 21.08mm (0.83in) Mating, 3.25mm (0.128in) Tail.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |
Amphenol Communications Solutions |
Part No. |
87916-417HLF
|
Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 17 Positions, 2.54mm Pitch, Vertical, 21.08mm (0.83in) Mating, 3.25mm (0.128in) Tail.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |
Amphenol Communications Solutions |
Part No. |
87916-418HLF
|
Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 18 Positions, 2.54mm Pitch, Vertical, 21.08mm (0.83in) Mating, 3.25mm (0.128in) Tail.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |
Amphenol Communications Solutions |
Part No. |
131-6414-21D
|
Description |
Paladin® 112Gb/s Backplane Connector, 6-Pair, 4 Column, Right End Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
|
Tech specs |
|
|
|
Official Product Page
|
|

Bom2Buy.com

Price and Availability
|