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Amphenol Communications Solutions |
Part No. |
10131931-905ULF
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Description |
Minitek®, Board to Board, Receptacle, Surface Mount, Single row, 5 Positions, 2mm (0.079inch), horizontal.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
77311-119-05LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 05 Positions, 2.54 mm Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
69190-506
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Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 06 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
69190-516
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Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 16 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54111-419051700LF
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Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 5 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
77311-819-05LF
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Description |
BergStik<sup>®<sup>, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical Header, Through Hole, Single Row, 5 Positions
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Tech specs |
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Official Product Page
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Texas Instruments |
Part No. |
M38510/11905BPA
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Description |
High Speed Low-Noise JFET-Input Dual Operational Amplifier 8-CDIP -55 to 125
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Tech specs |
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Official Product Page
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Tyco Electronics
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Part No. |
2-1191566-7 2-1190527-4 2-1191560-6 014389-000 2-1191569-0
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Description |
WIRE, RADIATION-CROSSLINKED, MODIFIED, ETFE-INSULATED, TIN-COATEDCOPPER, LIGHTWEIGHT WIRE, RADIATION-CROSSLINKED, MODIFIED, ETFE-INSULATED, TIN-COATEDCOPPER, LIGHTWEIGHT WIRE, RADIATION-CROSSLINKED, MODIFIED, ETFE-INSULATED, TIN-COATED COPPER, LIGHTWEIGHT WIRE RADIATIONN-CROSSLINKED, MODIFIED, ETFE-INSULATED, TIN-COATEDCOPPER, LIGHTWEIGHT
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File Size |
58.57K /
2 Page |
View
it Online |
Download Datasheet
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Texas Instruments |
Part No. |
TPS6521905RHBR
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Description |
User-programmable power management IC (PMIC) with three step-down DC/DC converters and four LDOs 32-VQFN -40 to 105
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Tech specs |
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Official Product Page
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Molex, Inc.
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Part No. |
19193-0089 19193-0074 19193-0073 19193-0092 19193-0007 19193-0078 19193-0079 19193-0017 19058-0072 19073-0004 19073-0042 19073-0040 19073-0037 19058-0063
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Description |
RING VERSAKRIMP (BB-339-08) 2 mm2, COPPER ALLOY, RING TERMINAL VERSAK RING TERM 16-14 BB-325-56 2 mm2, COPPER ALLOY, RING TERMINAL RING VERSAKRIMP TAPED (BB-325-14T) 2 mm2, COPPER ALLOY, RING TERMINAL RING VERSAKRIMP TAPED (BB-339-10T) 2 mm2, COPPER ALLOY, RING TERMINAL 191930007 0.8 mm2, COPPER ALLOY, RING TERMINAL 191930078 2 mm2, COPPER ALLOY, RING TERMINAL RING VERSAKRIMP TAPED (BB-337-06T) 2 mm2, COPPER ALLOY, RING TERMINAL 191930017 0.8 mm2, COPPER ALLOY, RING TERMINAL RING AVIKRIMP (B-830-56HD) 2 mm2, COPPER ALLOY, RING TERMINAL RING AVIKRIMP TAPED (AA-8111-04T) 0.8 mm2, COPPER ALLOY, TIN FINISH, RING TERMINAL RING AVIKRIMP (AA-832-08) 0.8 mm2, COPPER ALLOY, TIN FINISH, RING TERMINAL RING AVIKRIMP TAPED (AA-832-06T) 0.8 mm2, COPPER ALLOY, TIN FINISH, RING TERMINAL Ring Tongue Solderless Terminal; Wire Size (AWG):18-22; Insulator Color:Red; Series:RING AVIKRIMP TAPED (AA-832-04T) 0.8 mm2, COPPER ALLOY, TIN FINISH, RING TERMINAL RING AVIKRIMP (B-830-14HD) 2 mm2, COPPER ALLOY, RING TERMINAL
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File Size |
307.80K /
1 Page |
View
it Online |
Download Datasheet
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Texas Instruments |
Part No. |
JM38510/11905BPA
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Description |
High Speed Low-Noise JFET-Input Dual Operational Amplifier 8-CDIP -55 to 125
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Tech specs |
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Official Product Page
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Texas Instruments |
Part No. |
TPS6521905RSMR
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Description |
User-programmable power management IC (PMIC) with three step-down DC/DC converters and four LDOs 32-VQFN -40 to 105
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Tech specs |
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Official Product Page
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