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  70247-1054 Datasheet PDF File

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    70247-2451 0702472451

Molex Electronics Ltd.
Part No. 70247-2451 0702472451
Description 2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Low Profile, Right Angle, Shrouded24 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Platin
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded24 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 161.68K  /  4 Page

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Amphenol Communications Solutions

Part No. U95Z1054071321
Description QSFP STACKED COMBO NO LP
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    70247-1451 0702471451

Molex Electronics Ltd.
Part No. 70247-1451 0702471451
Description 2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Low Profile, Right Angle, Shrouded14 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Platin
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 161.68K  /  4 Page

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Amphenol Communications Solutions

Part No. U90B1054071100
Description ExpressPort QSFP+, High Speed Input Output Connectors, QSFP PLUS STACKED COMBO.
Tech specs    

Official Product Page

    70247-1654 0702471654

Molex Electronics Ltd.
Part No. 70247-1654 0702471654
Description 2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Low Profile, Right Angle, Shrouded16 Circuits, 0.127渭m (5渭") Gold (Au) Plating, Tin(Sn) PC TailPlating
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded16 Circuits, 0.127μm (5μ) Gold (Au) Plating, Tin(Sn) PC TailPlating

File Size 161.66K  /  4 Page

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Amphenol Communications Solutions

Part No. 54122-105460850LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 46 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    70247-1454 0702471454

Molex Electronics Ltd.
Part No. 70247-1454 0702471454
Description 2.54mm (.100") Pitch C-Grid庐 Header
2.54mm (.100) Pitch C-Grid? Header

File Size 164.39K  /  4 Page

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Amphenol Communications Solutions

Part No. U95Z1054081341
Description QSFP STACKED COMBO W LP
Tech specs    

Official Product Page

    70247-0851 0702470851

Molex Electronics Ltd.
Part No. 70247-0851 0702470851
Description 2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Low Profile, Right Angle, Shrouded, 8 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plati
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 161.67K  /  4 Page

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Amphenol Communications Solutions

Part No. U90B1054081100
Description ExpressPort QSFP+, High Speed Input Output Connectors, QSFP PLUS STACKED COMBO.
Tech specs    

Official Product Page

    70247-0852 0702470852

Molex Electronics Ltd.
Part No. 70247-0852 0702470852
Description 2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Low Profile, Right Angle, Shrouded,8 Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Platin
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded,8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 161.68K  /  4 Page

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Amphenol Communications Solutions

Part No. 68710-543
Description Quickie® IDC Cable-to-Board Connector System, Eject Latch Header, Vertical, Press Fit, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    70247-1252 0702471252

Molex Electronics Ltd.
Part No. 70247-1252 0702471252
Description 2.54mm (.100") Pitch C-Grid Header, Dual Row, Low Profile, Right Angle, Shrouded, 12 Circuits
2.54mm (.100) Pitch C-Grid Header, Dual Row, Low Profile, Right Angle, Shrouded, 12 Circuits

File Size 161.68K  /  4 Page

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Amphenol Communications Solutions

Part No. U95Z1054081321
Description QSFP STACKED COMBO W LP
Tech specs    

Official Product Page

    70247-1251 0702471251

Molex Electronics Ltd.
Part No. 70247-1251 0702471251
Description 2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Low Profile, Right Angle, Shrouded12 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Platin
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded12 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 161.68K  /  4 Page

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Amphenol Communications Solutions

Part No. U90B1054071220
Description ExpressPort QSFP+, High Speed Input Output Connectors, QSFP STACKED COMBO.
Tech specs    

Official Product Page

    70247-1652 0702471652

Molex Electronics Ltd.
Part No. 70247-1652 0702471652
Description 2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Low Profile, Right Angle, Shrouded16 Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Platin
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 161.68K  /  4 Page

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Amphenol Communications Solutions

Part No. U95Z1054071141
Description QSFP 2X1 COMBO GSKT NO LP
Tech specs    

Official Product Page

    70247-1051 0702471051

Molex Electronics Ltd.
Part No. 70247-1051 0702471051
Description 2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Low Profile, Right Angle, Shrouded10 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Platin
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 161.68K  /  4 Page

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Amphenol Communications Solutions

Part No. U90B1054071030
Description ExpressPort QSFP+, High Speed Input Output Connectors, QSFP STACKED COMBO.
Tech specs    

Official Product Page

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