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Molex Electronics Ltd.
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| Part No. |
70247-2451 0702472451
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| Description |
2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Low Profile, Right Angle, Shrouded24 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Platin 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded24 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
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| File Size |
161.68K /
4 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
U95Z1054071321
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| Description |
QSFP STACKED COMBO NO LP
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
70247-1451 0702471451
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| Description |
2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Low Profile, Right Angle, Shrouded14 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Platin 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
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| File Size |
161.68K /
4 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
U90B1054071100
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| Description |
ExpressPort QSFP+, High Speed Input Output Connectors, QSFP PLUS STACKED COMBO.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
70247-1654 0702471654
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| Description |
2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Low Profile, Right Angle, Shrouded16 Circuits, 0.127渭m (5渭") Gold (Au) Plating, Tin(Sn) PC TailPlating 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded16 Circuits, 0.127μm (5μ) Gold (Au) Plating, Tin(Sn) PC TailPlating
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| File Size |
161.66K /
4 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
54122-105460850LF
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| Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 46 position, 2.54mm (0.100in) pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
U95Z1054081341
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| Description |
QSFP STACKED COMBO W LP
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
70247-0851 0702470851
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| Description |
2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Low Profile, Right Angle, Shrouded, 8 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plati 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
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| File Size |
161.67K /
4 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
U90B1054081100
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| Description |
ExpressPort QSFP+, High Speed Input Output Connectors, QSFP PLUS STACKED COMBO.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
70247-0852 0702470852
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| Description |
2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Low Profile, Right Angle, Shrouded,8 Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Platin 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded,8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
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| File Size |
161.68K /
4 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
68710-543
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| Description |
Quickie® IDC Cable-to-Board Connector System, Eject Latch Header, Vertical, Press Fit, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
70247-1252 0702471252
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| Description |
2.54mm (.100") Pitch C-Grid Header, Dual Row, Low Profile, Right Angle, Shrouded, 12 Circuits 2.54mm (.100) Pitch C-Grid Header, Dual Row, Low Profile, Right Angle, Shrouded, 12 Circuits
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| File Size |
161.68K /
4 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
U95Z1054081321
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| Description |
QSFP STACKED COMBO W LP
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
70247-1251 0702471251
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| Description |
2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Low Profile, Right Angle, Shrouded12 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Platin 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded12 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
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| File Size |
161.68K /
4 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
U90B1054071220
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| Description |
ExpressPort QSFP+, High Speed Input Output Connectors, QSFP STACKED COMBO.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
70247-1652 0702471652
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| Description |
2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Low Profile, Right Angle, Shrouded16 Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Platin 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
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| File Size |
161.68K /
4 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
U95Z1054071141
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| Description |
QSFP 2X1 COMBO GSKT NO LP
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
70247-1051 0702471051
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| Description |
2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Low Profile, Right Angle, Shrouded10 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Platin 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
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| File Size |
161.68K /
4 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
U90B1054071030
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| Description |
ExpressPort QSFP+, High Speed Input Output Connectors, QSFP STACKED COMBO.
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| Tech specs |
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Official Product Page
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