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  70553-0114 Datasheet PDF File

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    11-40-2015 1140-2015 0011-40-2015 001140-2015

Molex Electronics Ltd.
Part No. 11-40-2015 1140-2015 0011-40-2015 001140-2015
Description Terminator Die

File Size 19.96K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114831-10114LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 14 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    11-40-4409 0011-40-4409 1140-4409 001140-4409

Molex Electronics Ltd.
Part No. 11-40-4409 0011-40-4409 1140-4409 001140-4409
Description Insulation Punch

File Size 14.44K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114828-10114LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 14 Positions
Tech specs    

Official Product Page

    11-40-2118 1140-2118 0011-40-2118 001140-2118

Molex Electronics Ltd.
Part No. 11-40-2118 1140-2118 0011-40-2118 001140-2118
Description Terminator Die

File Size 19.94K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114829-10114LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 14 Positions
Tech specs    

Official Product Page

    1140-4203 001140-4203 0011-40-4203

Molex Electronics Ltd.
Part No. 1140-4203 001140-4203 0011-40-4203
Description Conductor Punch

File Size 14.32K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114830-10114LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 14 Positions
Tech specs    

Official Product Page

    11-40-2014 1140-2014 0011-40-2014 001140-2014

Molex Electronics Ltd.
Part No. 11-40-2014 1140-2014 0011-40-2014 001140-2014
Description Terminator Die

File Size 19.42K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114508-D0J-20DLF
Description XCede® High Speed Backplane Connectors, Left polarizing guide module with key feature.
Tech specs    

Official Product Page

    1140-4200 0011-40-4200 001140-4200

Molex Electronics Ltd.
Part No. 1140-4200 0011-40-4200 001140-4200
Description Conductor Punch

File Size 14.32K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114828-10102LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 2 Positions
Tech specs    

Official Product Page

    0705530039 A705530039

Molex Electronics Ltd.
Part No. 0705530039 A705530039
Description
File Size 348.28K  /  5 Page

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Amphenol Communications Solutions

Part No. 10114868-L0J-10DLF
Description XCede® High Speed Backplane Connectors, 3 wall left header.
Tech specs    

Official Product Page

    A705530024 0705530024 70553-0024

Molex Electronics Ltd.
Part No. A705530024 0705530024 70553-0024
Description 2.54mm (.100) Pitch SL Header, Low Profile, Single Row, Right Angle, .120 Pocket, Shrouded, 25 Circuits

File Size 348.22K  /  5 Page

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Amphenol Communications Solutions

Part No. 10114508-00J-20DLF
Description XCede® High Speed Backplane Connectors, 2 wall header.
Tech specs    

Official Product Page

    HA60114

HBH Microwave GmbH
Part No. HA60114
Description 8.0 - 12.0 GHz High Power Amplifier

File Size 21.46K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114492-008LF
Description HPCE R/A REC 32P24S
Tech specs    

Official Product Page

    0201142

PHOENIX CONTACT
Part No. 0201142
Description Insertion bridge - EB 3- 6 - 0201142

File Size 43.23K  /  2 Page

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Amphenol Communications Solutions

Part No. 10114868-10J-10DLF
Description XCede® High Speed Backplane Connectors, 4 wall header.
Tech specs    

Official Product Page

For 70553-0114 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | <9> | 10 | 11 | 12 | 13 | 14 | 15 |   

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