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  74300-8163 Datasheet PDF File

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    90816-3208 0908163208

Molex Electronics Ltd.
Part No. 90816-3208 0908163208
Description 1.27mm (.050") Pitch Picoflex SMT Latched Vertical Header, 8 Circuits, Gold (Au) Plating, Black
1.27mm (.050) Pitch Picoflex SMT Latched Vertical Header, 8 Circuits, Gold (Au) Plating, Black
File Size 212.18K  /  4 Page

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Texas Instruments
Part No. DAC8163SDGSR
Description 14-Bit, Dual, Low Power, Ultra-low Glitch, Buffered Voltage Output DAC with 2.5V, 4ppm/&deg;C Reference 10-VSSOP -40 to 125
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HUA FENG CIRCUIT





    090816-3218 0908163218

Molex Electronics Ltd.
Part No. 090816-3218 0908163218
Description 1.27mm (.050") Pitch Picoflex SMT Latched Vertical Header, 18 Circuits, Gold (Au) Plating, Black
1.27mm (.050) Pitch Picoflex SMT Latched Vertical Header, 18 Circuits, Gold (Au) Plating, Black
File Size 212.18K  /  4 Page

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Texas Instruments
Part No. DAC8163SQDGSRQ1
Description Automotive Dual 14-Bit Ultralow-Glitch Low-Power Buff. Voltage-Output DAC 10-VSSOP -40 to 125
Tech specs 　 　

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    K4M28163PH

Samsung semiconductor
Part No. K4M28163PH
Description 2M x 16Bit x 4 Banks Mobile SDRAM
File Size 140.49K  /  12 Page

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Texas Instruments
Part No. DAC8163TDGST
Description DAC8163T Dual,14-Bit,Low Power with 2.5-V,4ppm/C Internal Ref,Reset to Mid-scale and 5V TTL I/O 10-VSSOP -40 to 125
Tech specs 　 　

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    0908163510 90816-3510

Molex Electronics Ltd.
Part No. 0908163510 90816-3510
Description 1.27mm (.050) Pitch Picoflex SMT Latched Vertical Header, 10 Circuits, Gold (Au) Plating, Black
File Size 212.19K  /  4 Page

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Texas Instruments
Part No. DAC8163SDSCR
Description 14-Bit, Dual, Low Power, Ultra-low Glitch, Buffered Voltage Output DAC with 2.5V, 4ppm/&deg;C Reference 10-WSON -40 to 125
Tech specs 　 　

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    Samsung
Part No. K4S281632K
Description 128Mb K-die SDRAM
File Size 251.68K  /  14 Page

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Texas Instruments
Part No. DAC8163TDGSR
Description DAC8163T Dual,14-Bit,Low Power with 2.5-V,4ppm/C Internal Ref,Reset to Mid-scale and 5V TTL I/O 10-VSSOP -40 to 125
Tech specs 　 　

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    0908163512 90816-3512

Molex Electronics Ltd.
Part No. 0908163512 90816-3512
Description 1.27mm (.050) Pitch Picoflex SMT Latched Vertical Header, 12 Circuits, Gold (Au) Plating, Black
File Size 212.19K  /  4 Page

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Texas Instruments
Part No. DAC8163TDSCR
Description DAC8163T Dual,14-Bit,Low Power with 2.5-V,4ppm/C Internal Ref,Reset to Mid-scale and 5V TTL I/O 10-WSON -40 to 125
Tech specs 　 　

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Official Product Page

    0908163524 90816-3524

Molex Electronics Ltd.
Part No. 0908163524 90816-3524
Description 1.27mm (.050) Pitch Picoflex SMT Latched Vertical Header, 24 Circuits, Gold (Au) Plating, Black
File Size 212.19K  /  4 Page

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Texas Instruments
Part No. DAC8163TDSCT
Description DAC8163T Dual,14-Bit,Low Power with 2.5-V,4ppm/C Internal Ref,Reset to Mid-scale and 5V TTL I/O 10-WSON -40 to 125
Tech specs 　 　

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    K4S281632K

Samsung semiconductor
Part No. K4S281632K
Description 128Mb K-die SDRAM Specification
File Size 271.10K  /  15 Page

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Texas Instruments
Part No. DAC8163SDGST
Description 14-Bit, Dual, Low Power, Ultra-low Glitch, Buffered Voltage Output DAC with 2.5V, 4ppm/&deg;C Reference 10-VSSOP -40 to 125
Tech specs 　 　

Official Product Page

    Samsung Electronic
Part No. K4H281638D
Description 128Mb DDR SDRAM Data Sheet
File Size 317.02K  /  51 Page

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Texas Instruments
Part No. DAC8163SDSCT
Description 14-Bit, Dual, Low Power, Ultra-low Glitch, Buffered Voltage Output DAC with 2.5V, 4ppm/&deg;C Reference 10-WSON -40 to 125
Tech specs 　 　

Official Product Page

    0908163326

Molex Electronics Ltd.
Part No. 0908163326
Description 1.27mm (.050) Pitch Picoflex SMT Latched Vertical Header, 26 Circuits, Gold (Au) Plating, Black
File Size 212.17K  /  4 Page

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Amphenol Communications Solutions
Part No. 47743-000LF
Description PV® Wire-to-Board Connector System, 2.54mm (0.1inch) Centerline Crimp-to-Wire Receptacle.
Tech specs 　 　

Official Product Page

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