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  die cell Datasheet PDF File

For die cell Found Datasheets File :: 3051    Search Time::2.203ms    
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    ZXLD381 ZXLD383 ZXLD383ET5TA

Diodes Incorporated
Part No. ZXLD381 ZXLD383 ZXLD383ET5TA
OCR Text ... saving tsot23-5 package or in die form, offering an excellent cost vs. performance solution for single cell led driving applications. features ? 85% efficiency ? user adjustable output current ? single cell operation ? low sat...
Description SINGLE OR MULTI cell LED DRIVER SOLUTION

File Size 151.06K  /  10 Page

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    AN605

Vishay Siliconix
Part No. AN605
OCR Text ... cost. However, the increase in die per wafer, which improves cost benefits, and reduction in rDS(on), which improves performance, remain th...cell wafer in an area that demonstrates the high-density cell scaling. To achieve such a cell figure...
Description Power MOSFET Basics: Understanding MOSFET Characteristics Associated With The Figure of Merit

File Size 96.70K  /  4 Page

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    MMA6519KW MMA6519KWR2 MMA6525KW MMA6525KWR2 MMA6527KW MMA6527KWR2 MMA65XX

Freescale Semiconductor, Inc
Part No. MMA6519KW MMA6519KWR2 MMA6525KW MMA6525KWR2 MMA6527KW MMA6527KWR2 MMA65XX
OCR Text ...de for analog circuitry. 17 pad die attach pad this pin is the die attach flag, and is internally connected to v ss . reference section 5...cell stops) x/y-axis, any range positive/negative g g-cell_clip 500 560 600 g (19) sensor freescal...
Description Dual-Axis SPI Inertial Sensor

File Size 1,215.31K  /  56 Page

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    PCA8885TSQ900 PCA8885TSQ9001

NXP Semiconductors
Part No. PCA8885TSQ900 PCA8885TSQ9001
OCR Text ...imum resolution: 9 x 102 - bare die with bumps for chip-on-glass (cog) applications ` capacitive sensor pca8885 - tssop28 package - 8 sen...cell ito touch layer type pacage and description deliery format ic ersion pca8538ug/2da/q1 bare...
Description Touch-sensitive segmented 9 x 102 display

File Size 125.80K  /  2 Page

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    Sensitron Semiconductor
Part No. SEN-R-956-XXX SEN-R-956-009 SEN-R-956-012 SEN-R-956-020 SEN-R-956-006 SEN-R-956-014 SEN-R-956-016 SEN-R-956-018 SEN-R-956-001 SEN-R-956-007 SEN-R-956-041 SEN-R-956-046 SENSITRONSEMICONDUCTOR-SEN-R-956-022
OCR Text die WITH HEAT ABSORBING STANDOFF TERMINAL STRIPS TRANSIENT VOLTAGE SUPPRESSOR 500 WATT SERIES Glass Passivated die Plus Dual Heat Strips ...cell" with its own heat absorbing terminals pre-bonded at high temperature. This permits mounting on...
Description TRANSIENT VOLTAGE SUPPRESSOR 500 WATT SERIES Glass Passivated die Plus Dual Heat Strips BIDIRECTIONAL, SILICON, TVS DIODE

File Size 78.26K  /  5 Page

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    SUM60N08-07C SI6862DQ SI4730EY AN606 SUM50N03-13LC

VISAY[Vishay Siliconix]
Vishay Intertechnology,Inc.
Part No. SUM60N08-07C SI6862DQ SI4730EY AN606 SUM50N03-13LC
OCR Text ... Table 1, and the Current-Sense die Characteristics and Schematic, Figure 2, help to demonstrate the current-sensing operation and circuit i...cell current in each path. Mathematically: r = ID/ISENSE ID is drain current www.vishay.com ISEN...
Description Current-Sensing Power MOSFETs

File Size 65.75K  /  4 Page

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    TGF2023-10

TriQuint Semiconductor
Part No. TGF2023-10
OCR Text ...l drawing ground is backside of die chip edge to bond pad dimensions are shown to cente r of pad die x,y size tolerance: +/- 0.050 thickness: 0.100 units: millimeters 0.154 x 2.050 vd bond pad #9 0.154 x 0.115 vg bond pad #1 - 8 tgf2023-1...
Description 50 Watt Discrete Power GaN on SiC HEMT

File Size 216.85K  /  7 Page

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    K5N1229ACD-BQ12

Samsung semiconductor
Part No. K5N1229ACD-BQ12
OCR Text ... - 512M Bit SLC Mux NOR Flash C-die_Ver 1.0 - 128M Bit Mux UtRAM2 C-die_Ver 1.0 <Common> - Finalized. 1.0 Jun. 22, 2010 Final H....cell. The device supports the traditional SRAM like asynchronous operation (asynchronous read and as...
Description 512Mb (32M x16) Muxed Burst, Multi Bank SLC NOR Flash

File Size 1,163.11K  /  128 Page

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    AT84CS001VTP AT84XCS001TP AT84CS001 AT84CS001TP-EB ATMELCORP-AT84XCS001TP

Atmel, Corp.
Atmel Corp.
ATMEL[ATMEL Corporation]
Part No. AT84CS001VTP AT84XCS001TP AT84CS001 AT84CS001TP-EB ATMELCORP-AT84XCS001TP
OCR Text ...or rapid debugging of the DMUX. die junction temperature monitoring is possible by sensing the voltage drop across a diode implemented close...cell Input signals for stand-alone delay cell Control signal for standalone delay cell Control signa...
Description 10-BIT 1:2/4 2.2GHz LVDS DMUX 84 SERIES, 1 LINE TO 4 LINE MULTIPLEXER AND DEMUX/DECODER, TRUE OUTPUT, BGA240
Selectable 10-bit 1:4 or 1:2 ratio 2.2 Gsps DMUX in EBGA package. A monolithic high-speed demultiplexer providing easy interfacing ...

File Size 88.46K  /  8 Page

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For die cell Found Datasheets File :: 3051    Search Time::2.203ms    
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