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ground-wire Datasheet PDF File

For ground-wire Found Datasheets File :: 21421 Search Time::2.781ms
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				Hittite Microwave Corporation
Part No.	HMC-XDH158
OCR Text	...ION: GOLD. 4. BACKSIDE METAL IS GROUND. 5. BOND PAD METALLIZATION: GOLD. 6. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS. 7. OVERALL DIE ...wire length. Typical die-to-substrate spacing is 0.076mm to 0.152 mm (3 to 6 mils). 0.102mm (0.004"...
Description	GaAs MMIC X4 ACTIVE FREQUENCY MULTIPLIER, 54 - 64 GHz OUTPUT
File Size	190.21K / 6 Page	View it Online	Download Datasheet

				Estek Electronics Co. Ltd
Part No.	K24C020-DCR-A K24C020-DCR-S K24C020-DCRG-A K24C020-DCRG-S K24C020-DCT-A K24C020-DCT-S K24C020-DCTG-A K24C020-DCTG-S K24C020-DER-A K24C020-DER-S K24C020-DERG-A K24C020-DET-A K24C020-DET-S K24C020-DETG-A K24C020-DETG-S K24C020-DIR-A K24C020-DIR-S K24C020-DIRG-A K24C020-DIRG-S K24C020-DIT-A K24C020-DIT-S K24C020-DITG-A K24C020-DITG-S K24C020-RCR-A K24C020-RCR-S K24C020-RCRG-A K24C020-RCRG-S K24C020-RCT-A K24C020-RCT-S 24C02 24C16 K24C020-RIR-A K24C040-RIR-A K24C080-RIR-A K24C160-RIR-A K24C020-RIR-S K24C040-RIR-S K24C080-RIR-S K24C160-RIR-S K24C020-RIRG-A K24C040-RIRG-A K24C080-RIRG-A K24C160-RIRG-A K24C020-RIRG-S K24C040-RIRG-S K24C080-RIRG-S K24C160-RIRG-S K24C020-SCT-A K24C040-SCT-A K24C080-SCT-A K24C160-SCT-A K24C020-SCT-S K24C040-SCT-S K24C080-SCT-S K24C160-SCT-S K24C040-RCT-A K24C080-RCT-A K24C160-RCT-A K24C040-RCR-A K24C080-RCR-A K24C160-RCR-A K24C040-RCR-S K24C080-RCR-S K24C160-RCR-S K24C020-RET-A K24C040-RET-A K24C080-RET-A K24C160-RET-A K24C020-RET-S K24C040-RET-S K24C080-RET-S K24C160-RET-S K24C040-DIRG-A K24C080-DIRG-A K24C160-DIRG-A K24C020-SIRG-A K24C040-SIRG-A K24C080-SIRG-A K24C160-SIRG-A K24C020-WIRG-A K24C040-WIRG-A K24C080-WIRG-A K24C160-WIRG-A K24C040-DIRG-S K24C080
OCR Text	...erial Clock Input Write Protect Ground Power Supply No Connect I/O & Open-drain I I P P NC BEIJING ESTEK ELECTRONICS CO.,LTD 1 ...wire addressing and a total of four 4K devices may be addressed on a 24C08 only uses the A2 input fo...
Description	8-lead PDIP, 8-lead SOP and 8-lead TSSOP Packages
File Size	915.95K / 13 Page	View it Online	Download Datasheet

				Zetex Semiconductors
Part No.	ZXCW6100S2804
OCR Text	...supply voltage, 3.3V Core logic ground LVTTL IP LVTTL IP LVTTL IP Digital audio word clock, matches to system sampling rate Digital audio bi...wire SPI interface. The 8 bit control and 64 bit data words directed through the SPI interface are u...
Description	24 BIT STEREO DIRECT DRIVE DIGITAL AUDIO AMPLIFIER
File Size	417.36K / 24 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC-MDB207
OCR Text	...ION: GOLD. 4. BACKSIDE METAL IS GROUND. 5. BOND PAD METALLIZATION: GOLD. 6. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS. 7. OVERALL DIE ...Wire Bond 0.076mm (0.003") 3 MIXERS - I/Q MIXERS / IRM - CHIP 50 Ohm Microstrip transmission ...
Description	GaAs MMIC I/Q MIXER 55 - 64 GHz
File Size	237.64K / 8 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC659
OCR Text	...TION: GOLD 6. BACKSIDE METAL IS GROUND 7. NO CONNECTION REQUIRED FOR UNLABELED BOND PADS 8. OVERALL DIE SIZE IS .002 3 - 126 For price...wire length. Typical die-to-substrate spacing is 0.076mm to 0.152 mm (3 to 6 mils). 0.102mm (0.004"...
Description	GaAs PHEMT MMIC POWER AMPLIFIER, DC - 15 GHz
File Size	317.01K / 8 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC609
OCR Text	... Thermal Resistance (channel to ground pad) Storage Temperature Operating Temperature 7 Vdc +15 dBm 150 C 1.17 W 55 C/W -65 to +150 C -40 to...wire length. Typical die-to-substrate spacing is 0.076mm (3 mils). 1 Wire Bond 0.076mm (0.003...
Description	GaAs PHEMT MMIC LOW NOISE AMPLIFIER, 2 - 4 GHz
File Size	298.72K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC608
OCR Text	...h gain mode (Vpd pin shorted to ground); and low gain mode (Vpd pin left open). The electrical specifications in the table below are shown f...wire length. Typical die-to-substrate spacing is 0.076mm (3 mils). 3 Wire Bond 0.076mm (0.003...
Description	GaAs PHEMT MEDIUM POWER AMPLIFIER, 9.5 - 11.5 GHz
File Size	370.53K / 8 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC-XDB112
OCR Text	...ION: GOLD. 4. BACKSIDE METAL IS GROUND. 5. BOND PAD METALLIZATION: GOLD. 6. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS. 7. OVERALL DIE ...wire length. Typical die-to-substrate spacing is 0.076mm to 0.152 mm (3 to 6 mils). 0.102mm (0.004"...
Description	GaAs MMIC PASSIVE FREQUENCY DOUBLER, 10 - 15 GHz INPUT
File Size	154.20K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC572
OCR Text	...TION: GOLD 5. BACKSIDE METAL IS GROUND 6. OVERALL DIE SIZE 0.002 For price, delivery, and to place orders, please contact Hittite Microwa...wire length. Typical die-to-substrate spacing is 0.076mm (3 mils). 0.102mm (0.004") Thick GaAs MM...
Description	GaAs MMIC I/Q DOWNCONVERTER 24 - 28 GHz
File Size	261.22K / 8 Page	View it Online	Download Datasheet

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