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California Micro Devices Corporation
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Part No. |
CM1206-16CP CM1206-16CS L06 CM1206-04CP CM1206-04CS CM1206-08CP CM1206-08CS 120608
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OCR Text |
...SIDE VIEW
0.35 DIA. 63/37 sn/pb (Eutectic) or 95.5/3.8/0.7 sn/Ag/Cu (Lead-free) SOLDER BUMPS DIMENSIONS IN MILLIMETERS
# per tape and reel
Package Dimensions for CM1206-04 6-bump Chip Scale Package
Controlling dimension: millime... |
Description |
ESD Protection Arrays, Chip Scale Package 4, 8 and 16-Channel ESD Protection Arrays in Chip Scale Package with OptiGuard Coating (PACDN24xxC pin compatible)
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File Size |
214.76K /
7 Page |
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Vishay Intertechnology,Inc. Vishay Intertechnology, Inc. Vishay Semiconductors
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Part No. |
TFDU4202-TR3 TFDU4202-TR1
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OCR Text |
...US Patent No. 6,157,476 * Lead (pb)-free device * Device in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC
Applications
* * * * Mobil...sn/pb soldering
260 240 220 200 180 160 140 120 100 80 60 40 20 0 0 50 100 150 200 250 300 350 1943... |
Description |
Integrated Low Profile Transceiver Module for Telecom Applications - IrDA Standard 集成的收发器模块超薄电信应用-红外标准
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File Size |
204.55K /
13 Page |
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Multicomp
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Part No. |
U0805CXXXXXT U0805F104ZCT
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OCR Text |
...amic Ag-Pd Ag layer Ni layer sn-pb layer or sn layer Minimum Termination Plating Thickness ( m) 40 1.5 - 3.5 3-8
BME Series
Number 1 2 3 4 5 Specifications Ceramic Dielectric Internal Electrode End Termination Material Ceramic Ni Cu la... |
Description |
Multilayer Ceramic Capacitors
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File Size |
701.01K /
18 Page |
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it Online |
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HSMC CORP.
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Part No. |
TO-220AB TO-220FP TO-263
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OCR Text |
...mension
Marking:
A D B E C F
pb Free Mark
pb-Free: " . " (Note) Normal: None H
Spec. No. : MOS200402 Issued Date : 2004.04.01 Revised...sn/3.0Ag/0.5Cu or Pure-Tin (pb-free) * Mold Compound: Epoxy resin family, flammability solid burning... |
Description |
N-Channel Power Field Effect Transistor
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File Size |
71.48K /
6 Page |
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it Online |
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Price and Availability
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