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  VB-3141 Datasheet PDF File

For VB-3141 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | <9> | 10 | 11 | 12 | 13 | 14 | 15 |   

   
Part No. 50045-1087A 50045-6087A 50045-1129C 50045-6108G 50045-5123M 50045-6084C 50045-1111D 50045-5111D 50045-3141G
Description 348 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, PRESS FIT
516 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, PRESS FIT
432 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, PRESS FIT
492 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, PRESS FIT
336 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, PRESS FIT
444 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, PRESS FIT
564 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, PRESS FIT

File Size 296.96K  /  2 Page

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Amphenol Communications Solutions

Part No. 76314-130LF
Description Dubox® 2.54mm, Board to Board Connector, 60 Positions,Double Row,Vertical,2.54mm pitch,Card Connector.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    MAX983141111

Maxim Integrated Products
Part No. MAX983141111
Description Mono 3.2W Class D Amplifier with Integrated Input Coupling Capacitors

File Size 2,005.80K  /  14 Page

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Amphenol Communications Solutions

Part No. 68031-415HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 15 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23in) Mating, 4.65 mm (0.183in) Tail.
Tech specs    

Official Product Page

    HYB314171BJ-70 HYB314171BJL-70

Infineon Technologies AG
Part No. HYB314171BJ-70 HYB314171BJL-70
Description 256K X 16 FAST PAGE DRAM, 70 ns, PDSO40 0.400 INCH, PLASTIC, SOJ-40

File Size 438.12K  /  25 Page

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Amphenol Communications Solutions

Part No. 77314-124LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Double Row, 6 Positions, 2.54 mm (0.100) Pitch.
Tech specs    

Official Product Page

    http://
SIEMENS A G
SIEMENS AG
Part No. HYB314171BJ-50- HYB314171BJL-50 HYB314171BJL-70 HYB314171BJ-60 HYB314171BJ-50 HYB314171BJ-70
Description 3.3V 256 K x 16-Bit Dynamic RAM 3.3V Low Power 256 K x 16-Bit Dynamic RAM with Self Refresh

File Size 1,342.36K  /  24 Page

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Amphenol Communications Solutions

Part No. 76314-103LF
Description Dubox® 2.54mm, Board to Board Connector, 6 Positions,Double Row,Vertical,2.54mm pitch,Card Connector.
Tech specs    

Official Product Page

    0022413141 22-41-3141 A-7720-D14A102A

Molex Electronics Ltd.
Part No. 0022413141 22-41-3141 A-7720-D14A102A
Description 2.54mm (.100) KK IDT Double Cantilever Contact, 14 Circuits, Tin (Sn), Feed-To, 26 Stranded or Solid
MOLEX Connector

File Size 484.91K  /  20 Page

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Amphenol Communications Solutions

Part No. 76314-135LF
Description Dubox® 2.54mm, Board to Board Connector, 70 Positions,Double Row,Vertical,2.54mm pitch,Card Connector.
Tech specs    

Official Product Page

    Infineon
SIEMENS[Siemens Semiconductor Group]
Part No. HYB314171BJL-70 HYB314171BJL-60 HYB314171BJL-50 HYB314171BJ-70 HYB314171BJ-60 HYB314171BJ-50 HB314171 HYB314171BJ-50-
Description 256k x 16 Bit FPM DRAM 3.3 V 60 ns
-3.3V 256 K x 16-Bit Dynamic RAM 3.3V Low Power 256 K x 16-Bit Dynamic RAM with Self Refresh
256k x 16 Bit FPM DRAM 3.3 V 70 ns
From old datasheet system

File Size 1,337.62K  /  24 Page

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Amphenol Communications Solutions

Part No. 77314-178LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100) Pitch.
Tech specs    

Official Product Page

    586-105111-2 586-305111-2 586-305111-3 586-105111-3 586-305111-3A 586-105111-3A 586-105111-5 586-305111-5 586-105111-6 5

List of Unclassifed Manufacturers
List of Unclassifed Manufac...
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Part No. 586-105111-2 586-305111-2 586-305111-3 586-105111-3 586-305111-3A 586-105111-3A 586-105111-5 586-305111-5 586-105111-6 586-116111-2 586-120111-3A 586-120111-7 586-120111-6A 586-120111-5 586-102111-3 586-102111-5 586-102111-6 586-102111-6A 586-102111-7 586-105111-6A 586-105111-7 586-108111-2 586-108111-3 586-108111-3A 586-108111-6 586-108111-6A 586-108111-7 586-114111-3 586-114111-3A 586-314111-3 586-314111-3A 586-114111-5 586-114111-6 586-114111-6A 586-314111-6 586-114111-7 586-314111-6A 586-314111-7 586-314111-5 586-314111-2 586-114111-2
Description Water resistant Double-make or double-break contacts
   Water resistant Double-make or double-break contacts

File Size 281.80K  /  3 Page

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Amphenol Communications Solutions

Part No. 77314-153LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Double Row, 50 Positions, 2.54 mm (0.100) Pitch.
Tech specs    

Official Product Page

    NXP Semiconductors N.V.
Part No. LPC3141FET180
Description ARM926EJ-S with 192 kB SRAM, USB High-speed OTG, SD-MMC, NAND flash controller 92kB静态随机存储器US2.0高速OTG,SD-MMC,NAND闪存控制器的ARM926EJ-S

File Size 519.98K  /  2 Page

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Amphenol Communications Solutions

Part No. 76314-140LF
Description Dubox® 2.54mm, Board to Board Connector, 80 Positions,Double Row,Vertical,2.54mm pitch,Card Connector.
Tech specs    

Official Product Page

    HYB314100BJL-70 HYB314100BJL-60 HYB314100BJ-50 HYB314100BJ-70 Q67100-Q2035 HYB314100BJ-60

http://
Infineon Technologies AG
SIEMENS AG
Part No. HYB314100BJL-70 HYB314100BJL-60 HYB314100BJ-50 HYB314100BJ-70 Q67100-Q2035 HYB314100BJ-60
Description 4M x 1-Bit Dynamic RAM Low Power 4M x 1-Bit Dynamic RAM 4M X 1 FAST PAGE DRAM, 50 ns, PDSO20
4M x 1-Bit Dynamic RAM Low Power 4M x 1-Bit Dynamic RAM 4米1位动态随机存储器的低功米1位动态随机存储器
4M X 1 FAST PAGE DRAM, 70 ns, PDSO20 0.300 INCH, PLASTIC, SOJ-26/20
4M x 1-Bit Dynamic RAM(Fast Page Mode)(4M x 1动RAM(快速页面模)

File Size 1,156.12K  /  23 Page

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Amphenol Communications Solutions

Part No. 77314-168LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Double Row, 10 Positions, 2.54 mm (0.100) Pitch.
Tech specs    

Official Product Page

    http://
SIEMENS AG
Part No. HYB314175BJ-50- HYB314175BJL-50 HYB314175BJ-60 HYB314175BJ-55 HYB314175BJL-60 HYB314175BJL-55 Q67100-Q2149 HYB314175BJ-50
Description High-Speed Fully-Differential Amplifiers 8-MSOP-PowerPAD -40 to 85 3.3V56亩16位江户的DRAM 3.3V56亩16位江户与DRAM的低功率版本自刷
3.3V 256 K x 16-Bit EDO-DRAM 3.3V 256 K x 16-Bit EDO-DRAM Low power version with Self Refresh
3.3V 256 K x 16-Bit EDO-DRAM(3.3V 256K×16外延式数据输出(EDO)动态RAM)

File Size 1,310.29K  /  24 Page

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Amphenol Communications Solutions

Part No. 77314-190LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Double Row, 34 Positions, 2.54 mm (0.100) Pitch.
Tech specs    

Official Product Page

For VB-3141 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | <9> | 10 | 11 | 12 | 13 | 14 | 15 |   

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