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  00158 Datasheet PDF File

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    15-80-0509 0015800509

Molex Electronics Ltd.
Part No. 15-80-0509 0015800509
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

File Size 1,218.38K  /  7 Page

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Amphenol Communications Solutions

Part No. 87900-158HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 58 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
Tech specs    

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HUA FENG CIRCUIT





    15-80-0525 0015800525

Molex Electronics Ltd.
Part No. 15-80-0525 0015800525
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 52 Circuits

File Size 1,218.29K  /  7 Page

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    15-80-0543 0015800543

Molex Electronics Ltd.
Part No. 15-80-0543 0015800543
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 54 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 1,218.29K  /  7 Page

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    15-80-0545 0015800545

Molex Electronics Ltd.
Part No. 15-80-0545 0015800545
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 54 Circuits

File Size 1,218.29K  /  7 Page

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    0015801324 001580-1324 0015-80-1324

Molex Electronics Ltd.
Part No. 0015801324 001580-1324 0015-80-1324
Description 2.54mm Pitch C-Grid? Header

File Size 25.53K  /  2 Page

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    15-80-0705 0015800705

Molex Electronics Ltd.
Part No. 15-80-0705 0015800705
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 70 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 1,218.29K  /  7 Page

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    15-80-0701 0015800701

Molex Electronics Ltd.
Part No. 15-80-0701 0015800701
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 70 Circuits, Tin (Sn) Plating

File Size 1,218.25K  /  7 Page

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    15-80-0605 0015800605

Molex Electronics Ltd.
Part No. 15-80-0605 0015800605
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 60 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 1,218.25K  /  7 Page

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    0015800665

Molex Electronics Ltd.
Part No. 0015800665
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 66 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 1,218.25K  /  7 Page

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    0015800661

Molex Electronics Ltd.
Part No. 0015800661
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 66 Circuits, Tin (Sn) Plating

File Size 1,218.21K  /  7 Page

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