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Toshiba Electronic Devices & Storage Corporation |
| Part No. |
XPN1300ANC
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| Description |
N-ch MOSFET, 100 V, 30 A, 0.0133 Ω@10V, TSON Advance(WF)
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| Tech specs |
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Official Product Page
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Rochester Electronics LLC |
| Part No. |
BLA1011-300
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| Description |
BLA1011-300 - 300W LDMOS Avionics Power Transistor
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
Molex, Inc.
MOLEX INC
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| Part No. |
5013001539 501330-0739 501330-0639 501330-1000 501330-0900 501330-1533 501330-1537 501330-1534 501330-1532 501330-1536 501330-1538 501330-1539 501330-1239 501330-1439 501330-0839 501330-0800 501330-0939 501330-1238 501330-1139
|
| Description |
1.0 WIRE TO BOARD CONN. 1-ROW RECEPACLE HOUSING 6-15CKT.
1.0 W/B 1-Row Rec Hsg 10Ckt 10 CONTACT(S), FEMALE, TWO PART BOARD CONNECTOR, CRIMP, RECEPTACLE
1.0 W/B 1-Row Rec Hsg 9Ckt 9 CONTACT(S), FEMALE, TWO PART BOARD CONNECTOR, CRIMP, RECEPTACLE
1.0 W/B 1-Row Rec Hsg 8Ckt 8 CONTACT(S), FEMALE, TWO PART BOARD CONNECTOR, CRIMP, RECEPTACLE
12 CONTACT(S), FEMALE, TWO PART BOARD CONNECTOR, RECEPTACLE
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| File Size |
164.89K /
2 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
54112-801300800LF
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| Description |
BERGSTIK STACKING
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
92813-007LF
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| Description |
Minitek® 2.00mm, Board to Board, Unshrouded Vertical Stacking Header, Surface Mount, Double Row, 40 Positions, 2.00mm (0.079in) Pitch..
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
92813-005LF
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| Description |
Minitek® 2.00mm, Board to Board, Unshrouded Vertical Stacking Header, Surface Mount, Double Row, 16 Positions, 2.00mm (0.079in) Pitch..
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
85013-3081 0850133081
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| Description |
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R, 1.0μm (39μ) Selective Gold (Au), 96 Circuits
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R, 1.0渭m (39渭) Selective Gold (Au), 96 Circuits
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R, 1.0楼矛m (39楼矛) Selective Gold (Au), 96 Circuits
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| File Size |
146.73K /
5 Page |
View
it Online |
Download Datasheet |
| |
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Amphenol Communications Solutions |
| Part No. |
10061913-003CLF
|
| Description |
PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Surface Mount, x16, 164 Positions, 1.00mm (0.039in) Pitch
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
85013-3093 0850133093
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| Description |
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R, 1.0μm (39μ)Selective Gold (Au), 96 Circuits
2.54mm (.100") Pitch DIN 41612 Header, Through Hole, Vertical, Style R, 1.0渭m (39渭")Selective Gold (Au), 96 Circuits
2.54mm (.100") Pitch DIN 41612 Header, Through Hole, Vertical, Style R, 1.0楼矛m (39楼矛")Selective Gold (Au), 96 Circuits
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| File Size |
146.04K /
5 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
54121-112021300LF
|
| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 2 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54121-407031300LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 3 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
75188-130-03LF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical header, Through Hole, Single Row, 3 Positions, 5.08mm (0.200in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54121-808121300LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 12 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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