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  52610-3072 Datasheet PDF File

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    0526103072 52610-3072

Molex Electronics Ltd.
Part No. 0526103072 52610-3072
Description 1.00mm (.039) Pitch FFC/FPC Connector, SMT, Vertical, ZIF, Gold (Au) ContactPlating, 30 Circuits, Lead-free, High Barrier Packaging
1.00mm (.039") Pitch FFC/FPC Connector, SMT, Vertical, ZIF, Gold (Au) ContactPlating, 30 Circuits, Lead-free, High Barrier Packaging

File Size 523.95K  /  8 Page

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Amphenol Communications Solutions

Part No. 10150526-1011HLF
Description 2.0MM WIRE TO BOARD HEADER
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    52610-1172

Molex Electronics Ltd.
Part No. 52610-1172
Description 1.00mm (.039) Pitch FFC/FPC Connector, SMT, Vertical, ZIF Receptacle, Gold (Au)Contact Plating, 11 Circuits, Lead-free, High Barrier Packaging
1.00mm (.039") Pitch FFC/FPC Connector, SMT, Vertical, ZIF Receptacle, Gold (Au)Contact Plating, 11 Circuits, Lead-free, High Barrier Packaging

File Size 523.93K  /  8 Page

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Amphenol Communications Solutions

Part No. 85261-001LF
Description Din Accessory Locking Frame 3x16
Tech specs    

Official Product Page

    Molex
Part No. 52610-2290
Description 1.0 FPC ZIF For SMT EmbsTp Pkg 22Ckt

File Size 33.73K  /  2 Page

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Texas Instruments

Part No. TPS3307-25DRG4
Description Triple Processor Supervisory Circuit 8-SOIC -40 to 85
Tech specs    

Official Product Page

    Molex, Inc.
Part No. 52610-1372
Description 1.0 FPC ZIF SMT Hsg Assy 13Ckt EmbsTpPkg 13 CONTACT(S), FEMALE, STRAIGHT FFC/FPC CONNECTOR, SURFACE MOUNT

File Size 176.34K  /  2 Page

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Texas Instruments

Part No. TPS3307-25DGNR
Description Triple Processor Supervisory Circuit 8-MSOP-PowerPAD -40 to 85
Tech specs    

Get Free Sample

Official Product Page

    Molex
Part No. 52610-1890
Description PC Board Connector; Number of Contacts:18; Pitch Spacing:1mm; Number of Rows:1; Mounting Type:PCB SMT; Body Material:PA Polyamide (Nylon) 4/6; Gender:Female

File Size 33.74K  /  2 Page

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Texas Instruments

Part No. TPS3307-25DR
Description Triple Processor Supervisory Circuit 8-SOIC -40 to 85
Tech specs    

Official Product Page

    Molex
Part No. 52610-1771
Description CON SMT ZIF 17 POS 0.039

File Size 26.12K  /  2 Page

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Texas Instruments

Part No. TPS3307-25DGNG4
Description Triple Processor Supervisory Circuit 8-MSOP-PowerPAD -40 to 85
Tech specs    

Official Product Page

    MOLEX INC
Part No. 52610-2290
Description 1.0 FPC ZIF For SMT EmbsTp Pkg 22Ckt

File Size 397.62K  /  7 Page

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Texas Instruments

Part No. TPS3307-25DGN
Description Triple Processor Supervisory Circuit 8-MSOP-PowerPAD -40 to 85
Tech specs    

Official Product Page

    52610-1171

Molex Electronics Ltd.
Part No. 52610-1171
Description 1.00mm (.039) Pitch FFC/FPC Connector, SMT, Vertical, ZIF Receptacle, 11 CircuitsLead-free, High Barrier Packaging
1.00mm (.039") Pitch FFC/FPC Connector, SMT, Vertical, ZIF Receptacle, 11 CircuitsLead-free, High Barrier Packaging

File Size 504.02K  /  9 Page

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Texas Instruments

Part No. TPS3307-25DG4
Description Triple Processor Supervisory Circuit 8-SOIC -40 to 85
Tech specs    

Get Free Sample

Official Product Page

    52610-1272

http://
Molex Electronics Ltd.
Part No. 52610-1272
Description 1.00mm (.039) Pitch FFC/FPC Connector, SMT, Vertical, ZIF, Gold (Au) Contact Plating, 12 Circuits, Lead-free, High Barrier Packaging
1.00mm (.039") Pitch FFC/FPC Connector, SMT, Vertical, ZIF, Gold (Au) Contact Plating, 12 Circuits, Lead-free, High Barrier Packaging

File Size 523.95K  /  8 Page

View it Online

Download Datasheet

   

Texas Instruments

Part No. TPS3307-25D
Description Triple Processor Supervisory Circuit 8-SOIC -40 to 85
Tech specs    

Get Free Sample

Official Product Page

    52610-1371

Molex Electronics Ltd.
Part No. 52610-1371
Description 1.00mm (.039) Pitch FFC/FPC Connector, SMT, Vertical, ZIF Receptacle, 13 CircuitsLead-free, High Barrier Packaging
1.00mm (.039") Pitch FFC/FPC Connector, SMT, Vertical, ZIF Receptacle, 13 CircuitsLead-free, High Barrier Packaging

File Size 504.02K  /  9 Page

View it Online

Download Datasheet

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