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  73644-2105 Datasheet PDF File

For 73644-2105 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    73644-2105

Molex Electronics Ltd.
Part No. 73644-2105
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location A

File Size 163.64K  /  4 Page

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Rochester Electronics LLC

Part No. ADSP-2105BPZ-80
Description ADSP-2105 - 16-Bit Fixed-Point DSP Microprocessor (-40C to + 85C)
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    73644-1202

Molex Electronics Ltd.
Part No. 73644-1202
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location B

File Size 167.27K  /  4 Page

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Rochester Electronics LLC

Part No. ADSP-2105BPZ-80RL
Description ADSP-2105 - 16-Bit Fixed-Point DSP Microprocessor (-40C to + 85C)
Tech specs    

Official Product Page

    73644-2109

Molex Electronics Ltd.
Part No. 73644-2109
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position E, 72 Circuits

File Size 163.64K  /  4 Page

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Amphenol Communications Solutions

Part No. 54242-105080950LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    73644-2116

Molex Electronics Ltd.
Part No. 73644-2116
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location B, Polarizing Key Position N/A, 72 Circuits

File Size 163.64K  /  4 Page

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Amphenol Communications Solutions

Part No. 54242-105140950LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    73644-2110

Molex Electronics Ltd.
Part No. 73644-2110
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position F, 72 Circuits

File Size 174.00K  /  4 Page

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Amphenol Communications Solutions

Part No. 54122-105240900LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 24 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    73644-2117

Molex Electronics Ltd.
Part No. 73644-2117
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location A

File Size 163.63K  /  4 Page

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Amphenol Communications Solutions

Part No. 54122-107121050LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 12 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    73644-1203

Molex Electronics Ltd.
Part No. 73644-1203
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location A

File Size 159.58K  /  4 Page

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Amphenol Communications Solutions

Part No. 51742-10502400AALF
Description PwrBlade®, Power Supply Connectors, 5P 24S STB Vertical Receptacle.
Tech specs    

Official Product Page

    73644-1205

Molex Electronics Ltd.
Part No. 73644-1205
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location A, Polarizing Key Position C, 144 Circuits

File Size 167.28K  /  4 Page

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Amphenol Communications Solutions

Part No. 51952-105LF
Description PwrBlade®, Power Supply Connectors, 4P 24S 4P Vertical Header.
Tech specs    

Official Product Page

    73644-1204

Molex Electronics Ltd.
Part No. 73644-1204
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position C, 144 Circuits

File Size 167.28K  /  4 Page

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Amphenol Communications Solutions

Part No. 54242-105220950LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 22 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    73644-2101

Molex Electronics Ltd.
Part No. 73644-2101
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position A, 72 Circuits

File Size 163.64K  /  4 Page

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Amphenol Communications Solutions

Part No. 54122-105460850LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 46 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

For 73644-2105 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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