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Amphenol Communications Solutions |
| Part No. |
L717HDC62POL2C309
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| Description |
Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 62 Pin, 0.76m (30 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10155552-C303KLF
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| Description |
Minitek MicroSpaceXS,1.27mm Crimp-to-Wire Connector Platform, wire-to-board, Header Vertical, 3 Position., STG, Side Latch, Gold; C Coding
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L717TSA15POL2C309
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| Description |
Dsub, Stamped Signal 3A, Straight PCB Thru Hole Low Profile, Height=6.02mm(0.237in), 15 Pin, Bright Tin Shell+Grounding Dimples, 0.76m(30 in) Gold, 3.05mm (0.120in) Clear Hole
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L717HDAH26POL2C309
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| Description |
Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Pin, 0.76m (30 in) Gold, 4-40 Rear Nut Height 5.9mm, Without Bracket, Without Boardlock
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10155502-C308KLF
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| Description |
Minitek MicroSpaceXS™ 1.27mm Crimp-to-Wire Connector Platform, wire-to-board, Header Vertical, 8 Position, STG, Top Latch, Gold; C Coding<br><br>(For product qualification latest status, please submit <a href=\\javascript:;\\ class=\\button product-enquiry\\ style=\\background: none;color: red;\\><span>Product Enquiry</span></a>)
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L77TSC37SOL2C309
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| Description |
Dsub, Stamped Signal 3A, Straight PCB Thru Hole Low Profile, Height=6.02mm(0.237in), 37 Socket, Bright Tin Shell, 0.76m(30 in) Gold, 3.05mm (0.120in) Clear Hole
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Official Product Page
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Holtek Semiconductor, Inc.
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| Part No. |
JEE245B0
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| Description |
TRANSISTOR | MOSFET POWER MODULE | 3-PH BRIDGE | 450V V(BR)DSS | 8A I(D) 晶体管| MOSFET功率模块| 3 - PH值大桥| 450V五（巴西）直| 8A条（丁）
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| File Size |
188.56K /
4 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
L77TSCH37SOL2C309
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| Description |
Dsub, Stamped Signal 3A, Straight PCB Thru Hole Low Profile, Height=6.02mm (.237in), 37 Socket, Bright Tin Shell, 0.76um (30u\\) Gold, 4-40 Threaded Rear Insert
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10155502-C309KLF
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| Description |
Minitek MicroSpaceXS™ 1.27mm Crimp-to-Wire Connector Platform, wire-to-board, Header Vertical, 9 Position, STG, Top Latch, Gold; C Coding<br><br>(For product qualification latest status, please submit <a href=\\javascript:;\\ class=\\button product-enquiry\\ style=\\background: none;color: red;\\><span>Product Enquiry</span></a>)
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L77HDC62SOL2C309
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| Description |
Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 62 Socket, 0.76m (30 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L77HDBH44SOL2C309
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| Description |
Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 44 Socket, 0.76m (30 in) Gold, 4-40 Rear Nut Height 5.9mm, Without Bracket, Without Boardlock
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Official Product Page
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Bom2Buy.com
Price and Availability
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