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| Part No. |
MCRF200-I/1C00A MCRF200-I/P00A
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| OCR Text |
...f = sawed wafer on frame (7 mil backgrind) w = wafer (11 mil backgrind) s = dice in waffle pack sn = 150 mil soic p=pdip 1c = 0.45 mm cob module with 1000 pf capacitor 3c = 0.70 mmcob module with 330 pf capacitor temperature i =-40 c to +... |
| Description |
SPECIALTY TELECOM CIRCUIT, XSS
SPECIALTY TELECOM CIRCUIT, PDIP8
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| File Size |
90.23K /
8 Page |
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it Online |
Download Datasheet
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PEREGRINE[Peregrine Semiconductor Corp.]
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| Part No. |
PE42660 42660-99 42660-00 42660-90
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| OCR Text |
...oviding good dice locations.
backgrind and Polish
Outgoing QA Inspection
Pack and Ship Wafers
Pack and Ship Dice
Figure 8. Waffle Pack
Storage and Preservation
Proper storage conditions are necessary to prevent product co... |
| Description |
SP6T UltraCMOS2.75 V Switch 100 - 3000 MHz
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| File Size |
289.60K /
9 Page |
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it Online |
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Microchip
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| Part No. |
MCRF355 MCRF360
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| OCR Text |
...? ? mil m (note 1, note 2) die backgrind thickness 7.5 190.5 8 203.2 8.5 215.9 mil m sawed 8? wafer on frame (option = wf) (note 3) 10 254 11 279.4 12 304.8 mil m bumped, sawed 8? wafer on frame (option = wfb) unsawed wafer (opti... |
| Description |
The MCRF355 is a uniquely designed read-only passive Radio Frequency Identification (RFID) IC device with advanced anticollision features optimized at 13.56 MHz. The device is powered remotely by rectifying RF magnetic fields that are tran
The MCRF360 is a uniquely designed read-only passive Radio Frequency Identification (RFID) IC device with advanced anticollision features operating at 13.56 MHz. The device is powered remotely by rectifying RF magnetic fields that are tran
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| File Size |
560.52K /
22 Page |
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it Online |
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