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						|  |  |  | TDK 
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						| Part No. | C8050X 
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						| OCR Text | ...dditions answer the electronics industrys need for higher density packaging. TDKs advanced technology allows for smaller size, highest capacitance, increased reliability, and automated assembly. Applications include computers and peripheral... |  
						| Description | Ceramic Chip 
 
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						| File Size | 598.59K  / 
						7 Page | 
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						|  |  |  | TDK 
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						| Part No. | C3216XXXX 
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						| OCR Text | ...dditions answer the electronics industrys need for higher density packaging. TDKs advanced technology allows for smaller size, highest capacitance, increased reliability, and automated assembly. Applications include computers and peripheral... |  
						| Description | Ceramic Chip 
 
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						| File Size | 580.57K  / 
						7 Page | 
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						|  |  |  | Conexant Systems, Inc. 
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						| Part No. | CX24130 
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						| OCR Text | ...lution conexants cx24130 is the industrys f rst single-chip dual-stream qpsk/ bpsk demodulator designed for satellite receiver systems. the device  is ideal for applications such as personal video recorders (pvrs) that  process dual incomin... |  
						| Description | Dual Stream QPSK/BPSK Demodulator lC 
 
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						| File Size | 190.02K  / 
						2 Page | 
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