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TRANSCOM
ETC[ETC]
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| Part No. |
TC2696
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| OCR Text |
...The TC2696 is packaged with the tc1606 Pseudomorphic High Electron Mobility Transistor (PHEMT) chip. The flange ceramic package provides the best thermal conductivity for the GaAs FET. All devices are 100% DC and RF tested to assure consist... |
| Description |
2 W Flange Ceramic Packaged PHEMT GaAs Power FETs
From old datasheet system
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| File Size |
38.19K /
2 Page |
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