| PART |
Description |
Maker |
| KTD2017 |
Low ON resistance 2.5V drive Mounting height 1.1mm Composite type, facilitating high-density mounting.
|
TY Semiconductor Co., Ltd
|
| LTV817MV |
High Density Mounting Type Photocoupler
|
LITEON
|
| LTV-849 LTV-849M LTV-849S LTV-829 LTV-829S-TA LTV8 |
HIGH DENSITY MOUNTING TYPE PHOTOCOUPLER
|
LITEON[Lite-On Technology Corporation]
|
| HCPL-817-36DE HCPL-817-36CE HCPL-817-36AE HCPL-817 |
Phototransistor Optocoupler High Density Mounting Type
|
AVAGO TECHNOLOGIES LIMITED
AVAGO TECHNOLOGIES LIMI...
|
| HCPL-817 |
Phototransistor Optocoupler High Density Mounting Type
|
AVAGO TECHNOLOGIES LIMITED
|
| EDZTE6115B |
2-pin ultra mini-mold type for high-density mounting (EMD2)
|
Rohm
|
| UDZSTE-175.1B |
Compact, 2-pin mini-mold type for high-density mounting. (UMD2)
|
Rohm
|
| HSB88WA |
CMPAK package is suitable for high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
| LTV-354T |
Hybrid substrates that require high density mounting
|
Lite-On Technology Corporation
|
