| PART |
Description |
Maker |
| 16188 16188-7 |
THERMAL INTERFACE PAD, (MAXI) 热接口垫，（马西
THERMAL INTERFACE PAD (MAXI)
|
Vicor, Corp.
VICOR[Vicor Corporation]
|
| PC93-20-5-2 |
Non-Silicone Thermal Conductive Pad
|
List of Unclassifed Man...
|
| P2NR |
For suggested pad layout, see drawing: PAD-01
|
All Sensors Corporation
|
| P2NS |
For suggested pad layout, see drawing: PAD-01
|
All Sensors Corporation
|
| LP0002 |
Thermal interface phase change material
|
List of Unclassifed Manufacturers
|
| TD1-2D00-031 |
Thermal Dispersion Flow/Level/Interface Switch
|
Magnetrol International, Inc.
|
| ZTACV-MX ZTTCV-MX |
2 Pad and 3 Pad Ceramic Package, 3.1 mm x 3.7 mm
|
ILSI America LLC
|
| U6803B_05 U6803B U6803B-MFPG3Y U6803B-MFPY U6803B0 |
Triple Driver IC with Thermal Monitoring SPECIALTY INTERFACE CIRCUIT, PDSO8
|
Atmel, Corp.
ATMEL[ATMEL Corporation]
|
| AMRI-1000 |
Mobile Navigation Interface IC for Navigation Pad Module
|
AVAGO TECHNOLOGIES LIMITED
|
| TC1046 EMC1001 MCP6041-I-SN EMC2112 TC74 TC621 TC6 |
Analog & Interface Product Selector Guide
Analog and Interface Product Selector Guide
Thermal Management ?Motor Driver ?Interface Peripherals Power Management ?Linear & Mixed Signal ?Safety & Security
Analog and Interface Product Selector Guide
Analog & Interface Product Selector Guide
|
Microchip Technology
|
| AT77C104BCB08V- |
FingerChip thermal fingerprint sweep sensor, hardware based, navigation and click function, SPI interface.
|
Atmel
|
| EYP2BH145 EYP05BE115 EYP05BE101 EYP1BF145 EYP2BH11 |
Thermal Cutoffs (TCO)/ Thermal-links Small and Insulation Type High Reliability
|
Panasonic Semiconductor
|
