PART |
Description |
Maker |
M6MGT641S8BKT M6MGB641S8BKT |
Memory>MCP(Multi Chip Package)>S-µMCP(Stacked micro MCP)
|
Renesas
|
DS42514 |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM MCP Flash Memory and SRAM From old datasheet system
|
AMD[Advanced Micro Devices]
|
DS42553 AM29DL323D |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM MCP Flash Memory and SRAM
|
AMD[Advanced Micro Devices]
|
AM50DLI28BG AM50DL128BG |
Am50DL128BG - Stacked Multi-Chip Package (MCP) Flash Memory and SRAM Am50DL128BG -堆叠式多芯片封装(MCP)闪存和SRAM
|
Advanced Micro Devices, Inc. Spansion, Inc.
|
S71WS-N S71WS512NB0BFWYP3 S71WS512NB0BAWAP3 S71WS5 |
Stacked Multi-Chip Product (MCP) SPECIALTY MEMORY CIRCUIT, PBGA84 Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品(MCP
|
Spansion Inc. Spansion, Inc.
|
DS42516 |
SPECIALTY MEMORY CIRCUIT, PBGA73 Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
SPANSION LLC ADVANCED MICRO DEVICES INC
|
S71GL032N40-0K S71GL032N80-0K S71GL-N S71GL032NA0- |
Stacked Multi-Chip Product (MCP) Flash Memory and RAM SPECIALTY MEMORY CIRCUIT, PBGA56
|
Spansion Inc. Spansion, Inc.
|
S72WS-N S72WS512NEG-LY S72WS512NFG-LY S72WS512NFG- |
Based MCP/PoP Products 基于MCP流行产品 Based MCP/PoP Products SPECIALTY MEMORY CIRCUIT, PBGA137
|
Spansion Inc. Spansion, Inc.
|
K524G2GACB-A050 |
MCP MEMORY
|
Samsung semiconductor
|
AM50DL128BH56I AM50DL128BH70I AM50DL128BH70IS |
Circular Connector; No. of Contacts:56; Series:MS27505; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:25; Circular Contact Gender:Socket; Circular Shell Style:Box Mount Receptacle RoHS Compliant: No Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 堆叠式多芯片封装(MCP)闪存和SRAM
|
Advanced Micro Devices, Inc.
|
AM50DL128CH70IS AM50DL128CH70IT AM50DL128CH85IS AM |
STACKED MULTI-CHIP PACKAGE (MCP) FLASH MEMORY AND SRAM
|
AMD[Advanced Micro Devices]
|
S71AL016D |
Stacked Multi-Chip Product (MCP) Flash Memory and RAM
|
SPANSION
|