| PART |
Description |
Maker |
| M6MGT331S8BKT M6MGB331S8BKT |
Memory>MCP(Multi Chip Package)>S-µMCP(Stacked micro MCP)
|
Renesas
|
| M6MGT331S4BKT M6MGB331S4BKT |
Memory>MCP(Multi Chip Package)>S-µMCP(Stacked micro MCP)
|
Renesas
|
| M6MGT647M17AKT |
Memory>MCP(Multi Chip Package)>S-µMCP(Stacked micro MCP)
|
Renesas
|
| AM41DL32X4GT85IS AM41DL32X4GT85IT AM41DL32X4GB85IT |
SPECIALTY MEMORY CIRCUIT, PBGA73
Circular Connector; No. of Contacts:41; Series:MS27505; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:21; Circular Contact Gender:Socket; Circular Shell Style:Box Mount Receptacle RoHS Compliant: No 堆叠式多芯片封装（MCP）闪存和SRAM
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
Spansion, Inc.
Advanced Micro Devices
|
| AM50DL128CG85IS |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM SPECIALTY MEMORY CIRCUIT, PBGA88
|
Spansion, Inc.
|
| AM70PDL127BDH66IS AM70PDL127BDH66IT AM70PDL127BDH8 |
Stacked Multi-Chip Package (MCP/XIP) Flash Memory, Data storage MirrorBit Flash, and pSRAM (XIP) 堆叠式多芯片封装（MCP / XIP）的快闪记忆体，数据存储的MirrorBit闪存和移动存储芯片（XIP）的
2 x 64 Megabit (8 M x 16-Bit) CMOS 3.0 Volt-Only Page Mode Flash Memory Data Storage 128 Megabit (8 M x 16-Bit) CMOS 2 × 64兆位米16位）的CMOS 3.0伏特，只有页面模式闪存数据存28兆位米16位）的CMOS
|
Spansion, Inc.
Spansion Inc.
|
| MB84VA2007-10 MB84VA20 MB84VA2006 MB84VA2006-10 MB |
MCP (Multi-Chip Package) FLASH MEMORY & SRAM 8M (x 8/x 16) FLASH MEMORY & 1M (x 8) STATIC RAM
|
Fujitsu Microelectronics
FUJITSU[Fujitsu Media Devices Limited]
|
| MB84VA2003-10 MB84VA20 MB84VA2002 MB84VA2002-10 MB |
MCP (Multi-Chip Package) FLASH MEMORY & SRAM 8M (x 8/x 16) FLASH MEMORY & 2M (x 8) STATIC RAM
|
Fujitsu Microelectronics
FUJITSU[Fujitsu Media Devices Limited]
|
| AM50DL128BH56I AM50DL128BH70I AM50DL128BH70IS |
Circular Connector; No. of Contacts:56; Series:MS27505; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:25; Circular Contact Gender:Socket; Circular Shell Style:Box Mount Receptacle RoHS Compliant: No
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 堆叠式多芯片封装（MCP）闪存和SRAM
|
Advanced Micro Devices, Inc.
|
| A82DL16X4T A82DL1624 A82DL1624TG-70 A82DL1624TG-70 |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit (2Mx8 Bit/1Simultaneous Operation Flash Memory and 4M (256Kx16 Bit) S
|
AMICC[AMIC Technology]
|
| M36W0R6050B3 M36W0R6050B3ZAQE M36W0R6050B3ZAQF M36 |
SPECIALTY MEMORY CIRCUIT, PBGA107
64-Mbit (4 Mbits 隆驴16, multiple bank, burst) Flash memory and 16-Mbit (1 Mbit 隆驴16) or 32-Mbit (2 Mbits x16) PSRAM MCP
512 Mbit (x16, Multiple Bank, Multi-Level, Burst) Flash memory 128 Mbit (Burst) PSRAM, 1.8V supply, Multi-Chip Package
64-Mbit (4 Mbits 】16, multiple bank, burst) Flash memory and 16-Mbit (1 Mbit 】16) or 32-Mbit (2 Mbits x16) PSRAM MCP
|
Numonyx B.V
|
