PART |
Description |
Maker |
DS42516 AM29DL324D |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
AMD[Advanced Micro Devices]
|
AM49DL640AG AM49DL640AG70IS AM49DL640AG70IT AM49DL |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
Advanced Micro Devices
|
AM70PDLI29BDH |
(AM70PDLI27BDH / AM70PDLI29BDH) Stacked Multi-Chip Package (MCP/XIP) Flash Memory
|
SPANSION
|
S73WS-P S75WS256NDGBFWLH2 S75WS256NDGBFWLH0 S75WS2 |
Stacked Multi-Chip Product (MCP) SPECIALTY MEMORY CIRCUIT, PBGA84 Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品(MCP
|
Spansion Inc. Spansion, Inc.
|
S75WS256NDFBFWLJ3 S75WS256NDFBAWLK2 S75WS256NDFBFW |
Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品(MCP Stacked Multi-Chip Product (MCP) SPECIALTY MEMORY CIRCUIT, PBGA84
|
Spansion, Inc. SPANSION LLC
|
M6MGE13VW34DWG-P |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
M6MGD13VW34DWG |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
M6MGB64BM34CWG M6MGT64BM34CWG |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
M6MGD13TW66CWG |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
DS42516 |
SPECIALTY MEMORY CIRCUIT, PBGA73 Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
SPANSION LLC ADVANCED MICRO DEVICES INC
|
AM49LV6408MT15I AM49LV4608MT15IS AM49LV4608MT15IT |
Stacked Multi-chip Package (MCP) 64 Mbit (4 M x 16 bit) Flash Memory and 8 Mbit (512K x 16-Bit) 堆叠式多芯片封装(MCP64兆位个M × 16位)闪存兆位(为512k × 16位) Stacked Multi-chip Package (MCP) 64 Mbit (4 M x 16 bit) Flash Memory and 8 Mbit (512K x 16-Bit) pseudo Static RAM 堆叠式多芯片封装(MCP64兆位个M × 16位)闪存兆位(为512k × 16位)伪静态存储器 Stacked Multi-chip Package (MCP) 64 Mbit (4 M x 16 bit) Flash Memory and 8 Mbit (512K x 16-Bit) pseudo Static RAM 堆叠式多芯片封装(MCP4兆位个M × 16位)闪存兆位(为512k × 16位)伪静态存储器
|
Spansion, Inc. Spansion Inc.
|