PART |
Description |
Maker |
B27A140BTA1 B27A B27A140BTB1 B27A12BAA1 B27A12BAB1 |
FEMALE HEADER SINGLE ROW PROFILE : 5.0mm SMT TYPE
|
DBLECTRO[DB Lectro Inc]
|
MRS2-XX-U-SMT |
DUAL ROW FEMALE MICRO HEADER
|
Adam Technologies, Inc.
|
829-22-005-20-002101 |
Interconnect Header Spring-Loaded Header Horizontal Mount Single Row Through Hole
|
Mill-Max Mfg. Corp.
|
829-22-006-20-002101 |
Interconnect Header Spring-Loaded Header Horizontal Mount Single Row Through Hole
|
Mill-Max Mfg. Corp.
|
829-22-012-20-002101 |
Interconnect Header Spring-Loaded Header Horizontal Mount Single Row Through Hole
|
Mill-Max Mfg. Corp.
|
829-22-020-20-002101 |
Interconnect Header Spring-Loaded Header Horizontal Mount Single Row Through Hole
|
Mill-Max Mfg. Corp.
|
B30240BT1 B30240BS1 B30 B3022BA1 B3022BB1 B3022BC1 |
FEMALE HEADER PROFILE : 5.8mm SIDE-ENTRY TYPE (DUAL ROW)
|
DBLECTRO[DB Lectro Inc]
|
350-10-101-00-001000 350-10-164-00-001000 350-90-1 |
HEADER STRIPS .100隆卤 Grid Solder Tail Single Row HEADER STRIPS .100 Grid Solder Tail Single Row
|
Mill-Max Mfg. Corp.
|
810-22-004-40-001101 |
Interconnect Header Spring-Loaded Header Horizontal Mount Single Row Surface Mount
|
Mill-Max Mfg. Corp.
|
0901200960 90120-0960 |
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, 40 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid III垄芒 Header, Single Row, Vertical, 40 Circuits, 0.76楼矛m (30楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
0901200776 90120-0776 |
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid III垄芒 Header, Single Row, Vertical, 16 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
2PH1-XX-SG-18-323-30 |
SINGLE ROW PIN HEADER
|
Adam Technologies, Inc.
|