| PART |
Description |
Maker |
| HMD4M144D9WG-5 HMD4M144D9WG-6 HMD4M144D9WG |
64Mbyte(4Mx144) 200-pin ECC Mode 4K Ref. DIMM Design 5V
|
Hanbit Electronics Co.,Ltd
|
| M381L6423DTM-CCC/C4 M381L3223DTM-CCC/C4 M368L6423D |
184pin Unbuffered Module based on 256Mb D-die 64/72-bit Non ECC/ECC 184pin缓冲模块56MbD为基础的非ECC的模4/72-bit / ECC
|
Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
|
| M381L6423DTM-LCC_C4 M368L1624DTM M368L1624DTM-CCC |
184pin Unbuffered Module based on 256Mb D-die 64/72-bit Non ECC/ECC
|
Samsung Electronic
SAMSUNG[Samsung semiconductor]
|
| M368L6423F M381L3223FTM M381L3223FTM-CLB3A2 M381L6 |
184pin Unbuffered Module based on 256Mb F-die with 64/72-bit Non-ECC / ECC
|
SANKEN[Sanken electric]
|
| M470T2953BS0-CD5_CC M470T6554BG0-CD5_CC M470T6554B |
40 Characters x 4 Lines, 5x7 Dot Matrix Character and Cursor 200pin缓冲的SODIMM基于512Mb乙芯4位非ECC
200pin Unbuffered SODIMM based on 512Mb B-die 64bit Non-ECC 200pin缓冲的SODIMM基于512Mb乙芯64位非ECC
64M X 64 DDR DRAM MODULE, 0.5 ns, ZMA200 ROHS COMPLIANT, SODIMM-200
32M X 64 DDR DRAM MODULE, 0.5 ns, ZMA200 ROHS COMPLIANT, SODIMM-200
200pin Unbuffered SODIMM based on 512Mb B-die 64bit Non-ECC 200pin缓冲的SODIMM基于512Mb乙芯4位非ECC
128M X 64 DDR DRAM MODULE, 0.5 ns, ZMA200 ROHS COMPLIANT, SODIMM-200
Triac; Thyristor Type:Snubberless; Peak Repetitive Off-State Voltage, Vdrm:400V; On State RMS Current, IT(rms):6A; Gate Trigger Current (QI), Igt:35mA; Current, It av:6A; Gate Trigger Current Max, Igt:35mA RoHS Compliant: Yes
|
Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Electronic
|
| 74061-2521 0740612521 |
2.00mm (.079) Pitch VHDM? Board-to-Board Backplane Header, Vertical, 8-RowGuide Pin Signal Module, Pin End Version, 200 Circuits, Pin Length 4.75mm (.187)
|
Molex Electronics Ltd.
|
| M381L6523DUM-LCC M368L2923DUN-CB3 M368L2923DUN-CCC |
DDR SDRAM Unbuffered Module 184pin Unbuffered Module based on 512Mb D-die with 64/72-bit Non ECC/ECC 66 TSOP-II with Pb-Free (RoHS compliant)
|
SAMSUNG[Samsung semiconductor]
|
| 74062-2513 0740622513 |
2.00mm (.079) Pitch VHDM? Board-to-Board Backplane Header, Vertical, 8-Row,Guide Pin Signal Module, Shield End Version, Pin End Version, 200 Circuits, Pin
|
Molex Electronics Ltd.
|
| 10-08-1021 AE-3003-2A 0010081021 0010-08-1032 AE-3 |
5.08mm (.200") Pitch KK垄莽 Header, Vertical, Round Pin, 2 Circuits, Tin (Sn) Plating, Pin Length 19.05mm (.750")
5.08mm (.200") Pitch KK庐 Header, Vertical, Round Pin, 2 Circuits, Tin (Sn) Plating, Pin Length 19.05mm (.750")
5.08mm (.200) Pitch KK? Header, Vertical, Round Pin, 2 Circuits, Tin (Sn) Plating, Pin Length 19.05mm (.750)
|
Molex Electronics Ltd.
|
| AE-3003-12AG 0010451121 10-45-1121 |
5.08mm (.200) Pitch KK? Header, Vertical, Round Pin, 12 Circuits, Gold (Au) Plating, Pin Length 19.05mm (.750)
5.08mm (.200") Pitch KK庐 Header, Vertical, Round Pin, 12 Circuits, Gold (Au) Plating, Pin Length 19.05mm (.750")
|
Molex Electronics Ltd.
|
| AE-3003-12A 10-08-1121 |
5.08mm (.200) Pitch KK? Header, Vertical, Round Pin, 12 Circuits, Tin (Sn) Plating, Pin Length 19.05mm (.750)
5.08mm (.200") Pitch KK庐 Header, Vertical, Round Pin, 12 Circuits, Tin (Sn) Plating, Pin Length 19.05mm (.750")
|
Molex Electronics Ltd.
|
| AE-3003-6AG 10-45-1061 0010451061 3003-06AG |
5.08mm (.200) Pitch KK? Header, Vertical, Round Pin, 6 Circuits, Gold (Au) Plating, Pin Length 19.05mm (.750)
5.08mm (.200") Pitch KK庐 Header, Vertical, Round Pin, 6 Circuits, Gold (Au) Plating, Pin Length 19.05mm (.750")
|
Molex Electronics Ltd.
|
|
