PART |
Description |
Maker |
AM42DL6404G |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
Advanced Micro Devices
|
AM41DL6408H8H85IT AM41DL6408H AM41DL6408H8H70IS AM |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
AMD[Advanced Micro Devices]
|
DS42516 AM29DL324D |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
AMD[Advanced Micro Devices]
|
AM49DL640AG85IT |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
Advanced Micro Devices
|
AM50DL128CH70IS AM50DL128CH70IT AM50DL128CH85IS AM |
STACKED MULTI-CHIP PACKAGE (MCP) FLASH MEMORY AND SRAM
|
AMD[Advanced Micro Devices]
|
A82DL1624T |
(A82DL16x4T) Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
AMIC Technology
|
MB84VD2119XEM-70 MB84VD21181EM-70PBS MB84VD21182EM |
Stacked MCP (Multi-Chip Package) FLASH MEMORY & SRAM CMOS
|
SPANSION[SPANSION]
|
S75WS256NDFBFWLJ3 S75WS256NDFBAWLK2 S75WS256NDFBFW |
Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品(MCP Stacked Multi-Chip Product (MCP) SPECIALTY MEMORY CIRCUIT, PBGA84
|
Spansion, Inc. SPANSION LLC
|
M6MGE13VW34DWG-P |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
M6MGD13VW34DWG-P |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
AM50DL128CG85IS |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM SPECIALTY MEMORY CIRCUIT, PBGA88
|
Spansion, Inc.
|
AM49LV6408MT15I AM49LV4608MT15IS AM49LV4608MT15IT |
Stacked Multi-chip Package (MCP) 64 Mbit (4 M x 16 bit) Flash Memory and 8 Mbit (512K x 16-Bit) 堆叠式多芯片封装(MCP64兆位个M × 16位)闪存兆位(为512k × 16位) Stacked Multi-chip Package (MCP) 64 Mbit (4 M x 16 bit) Flash Memory and 8 Mbit (512K x 16-Bit) pseudo Static RAM 堆叠式多芯片封装(MCP64兆位个M × 16位)闪存兆位(为512k × 16位)伪静态存储器 Stacked Multi-chip Package (MCP) 64 Mbit (4 M x 16 bit) Flash Memory and 8 Mbit (512K x 16-Bit) pseudo Static RAM 堆叠式多芯片封装(MCP4兆位个M × 16位)闪存兆位(为512k × 16位)伪静态存储器
|
Spansion, Inc. Spansion Inc.
|