| PART |
Description |
Maker |
| TEA2015A |
Vertical Sweep for Black and White and 60 Color TV Sets
|
Thomson
|
| 0908160326 90816-0326 |
1.27mm (.050) Pitch Picoflex SMT Latched Vertical Header, 26 Circuits, Tin (Sn) Plating, Black
1.27mm (.050") Pitch Picoflex SMT Latched Vertical Header, 26 Circuits, Tin (Sn) Plating, Black
MOLEX Connector
|
Molex Electronics Ltd.
|
| 0908160320 90816-0320 |
1.27mm (.050) Pitch Picoflex SMT Latched Vertical Header, 20 Circuits, Tin (Sn) Plating, Black
1.27mm (.050") Pitch Picoflex SMT Latched Vertical Header, 20 Circuits, Tin (Sn) Plating, Black
MOLEX Connector
|
Molex Electronics Ltd.
|
| 0901301128 90130-1128 |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 28 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 28 Circuits, Black, 3楼矛m (118楼矛) Tin (Sn) over Nickel (Ni)
|
Molex Electronics Ltd.
|
| 90130-1206 0901301206 |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 6 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 6 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 90130-1244 0901301244 |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 44 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 44 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 90130-1214 0901301214 |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 14 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 14 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 90130-1220 0901301220 |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 20 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 20 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 34792-0040 |
Mini50?Unsealed, Single Row, Vertical Header, 4 Circuit, Polarization Option A, Black, Tray
|
Molex Electronics Ltd.
|
| 0877159900 87715-9900 |
1.00mm (.039) Edgecard Connector, Vertical, Nylon 4/6 Glass-filled, Black Housing, Phosphor Bronze, 0.38μm (15μ) Gold (Au) Plating, with Plastic Pegs
1.00mm (.039) Edgecard Connector, Vertical, Nylon 4/6 Glass-filled, Black Housing, Phosphor Bronze, 0.38渭m (15渭) Gold (Au) Plating, with Plastic Pegs
|
Molex Electronics Ltd.
|
| 0908160004 90816-0004 |
1.27mm (.050) Pitch Picoflex SMT Latched Vertical Header, 4 Circuits, Tin (Sn) Plating, Black
|
Molex Electronics Ltd.
|
| 90816-3306 0908163306 |
1.27mm (.050) Pitch Picoflex SMT Latched Vertical Header, 6 Circuits, Gold (Au) Plating, Black
1.27mm (.050") Pitch Picoflex SMT Latched Vertical Header, 6 Circuits, Gold (Au) Plating, Black
|
Molex Electronics Ltd.
|
|
