PART |
Description |
Maker |
21-0147C |
PACKAGE OUTLINE, 6L UDFN, 1.5 X 1.0 X 0.8mm
|
Maxim Integrated Products, Inc. MAXIM[Maxim Integrated Products] MAXIM - Dallas Semiconductor
|
NUF8010MU |
Low Capacitance 8 Line EMI Filter with ESD Protection in UDFN Package
|
ON Semiconductor
|
NUF8000MUT2G NUF8000MU |
Low Capacitance 8 Line EMI Filter with ESD Protection in UDFN Package
|
ON Semiconductor
|
8SOIC |
8 PIN SOIC PACKAGE OUTLINE 8 PIN SOIC PACKAGE OUTLINE
|
SMSC[SMSC Corporation]
|
NTLUS4195PZ NTLUS4195PZTAG NTLUS4195PZTBG |
Power MOSFET −30 V, −4.0 A, Cool Single P−Channel, ESD, 1.6x1.6x0.55 mm UDFN Package
|
ON Semiconductor
|
SOD523 |
Surface mounted, 2 pin package Package outline
|
Zetex Semiconductors
|
AP2301BGN-HF AP2301BGN-HF-14 |
2.8 A, 20 V, 0.13 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3 Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp. Advanced Power Electronics Corp. Advanced Power Electron...
|
SC70-6 |
Package Outline
|
Global Mixed-mode Techn...
|
TQFN4X4-16 |
Package Outline
|
Global Mixed-mode Techn...
|
SOT23-3 |
Package Outline
|
Global Mixed-mode Techn...
|