| PART |
Description |
Maker |
| 21-0146 21-0146A |
PACKAGE OUTLINE 52L TQFP 10x10x1.0 MM
|
MAXIM - Dallas Semiconductor
|
| MDP0040 |
PACKAGE OUTLINE DRAWING QSOP - 0.150 NARROW BODY PACKAGE
|
Elantec Semiconductor
|
| MK2761ASTR MK2761A MK2761AS MK2761ASLF MK2761ASLFT |
Package Outline and Package Dimensions (16-pin SOIC, 150 Mil. Narrow Body)
|
ICST[Integrated Circuit Systems]
|
| SOT-89-3L |
SOT-89-3L PACKAGE OUTLINE DIMENSIONS
SOT-89-3L PACKAGE OUTLINE DIMENSIONS
|
List of Unclassifed Manufacturers
Electronic Theatre Controls, Inc.
|
| SOD523 |
Surface mounted, 2 pin package Package outline
|
Zetex Semiconductors
|
| SC70-5 |
Surface mounted / 5 pin package Package outline
|
Zetex Semiconductors
|
| TO92 |
Through hole, 3 pin package Package outline
|
Zetex Semiconductors
|
| DFN2X2-10 |
Package Outline
|
Global Mixed-mode Techn...
|
| SOD723 |
Package outline
|
NXP Semiconductors
PHILIPS[Philips Semiconductors]
|
| TQFN5X5-12 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN4X4-32 |
Package Outline
|
Global Mixed-mode Techn...
|
