| PART |
Description |
Maker |
| HHM1562B |
MULTILAYER BALUN SPECIFICATION
|
TDK Electronics
|
| HHM1517-15 |
Multilayer Balun
|
TDK Electronics
|
| HHM1715E1 |
Multilayer Balun
|
TDK Electronics
|
| HHM1515B2 HHM1522B1 HHM1523C1 HHM1524B1 |
Multilayer Balun Transformers For GSM900 Tx Rx
|
TDK Electronics
|
| HHM1517 HHM151713 HHM1520 HHM1521 HHM1541E1 |
Multilayer Balun Transformers For 2.4GHz W-LAN/Bluetooth
HHM Series
|
TDK Electronics
|
| 2222207556 2238207556 2255207555 2250207555 222220 |
General Purpose & High Capacitance
SURFACE-MOUNT CERAMIC MULTILAYER CAPACITORS
SURFACE-MOUNT CERAMICV MULTILAYER CAPACITORS
This specification describes X7R series chip capacitors with lead-free terminations
SURFACE-MOUNT CERAMIC MULTILAYER CAPACITORS
SURFACE-MOUNT CERAMICV MULTILAYER CAPACITORS
|
YAGEO Corporation
List of Unclassifed Manufac...
|
| MLVS-0402 MLVS0402L08 MLVS0402M04 MLVS0402M07 MLVS |
This specification is applicable to Chip Metal Oxide Varistor in multilayer technology.
|
List of Unclassifed Manufacturers
ETC
|
| AMCB21 |
MULTILAYER CHIP BALUN
|
Abracon Corporation
|
| MLVS-0603 |
This specification is applicable to Chip Metal Oxide Varistor in multilayer technology 本规范适用于金属氧化物压敏电阻片的多层技
|
Electronic Theatre Controls, Inc.
|
| HHM1713E2-15 |
Multilayer Balun
|
TDK Electronics
|
