| PART |
Description |
Maker |
| 21-0147C |
PACKAGE OUTLINE 6L UDFN 1.5 X 1.0 X 0.8mm
|
MAXIM - Dallas Semiconductor
|
| NTLUD3A50PZ NTLUD3A50PZTAG NTLUD3A50PZTBG |
?0 V, ?.6 A, Cool Dual P?Channel, 2.0x2.0x0.55 mm UDFN Package
|
ON Semiconductor
|
| STEVAL-IFS017V3 |
Temperature sensor daughter card based on the STTS751-1DP3F in UDFN package
|
ST Microelectronics
STMicroelectronics
|
| NUF8010MU |
Low Capacitance 8 Line EMI Filter with ESD Protection in UDFN Package 低电容EMI滤波线在UDFN微型封装的ESD保护
|
ON Semiconductor
|
| MDP0040 |
PACKAGE OUTLINE DRAWING QSOP - 0.150 NARROW BODY PACKAGE
|
Elantec Semiconductor
|
| SOD523 |
Surface mounted, 2 pin package Package outline
|
Zetex Semiconductors
|
| SC70-5 |
Surface mounted, 5 pin package Package outline
|
ZETEX[Zetex Semiconductors]
|
| SC70-6 |
Package Outline
|
Global Mixed-mode Techn...
|
| SSOP-28 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN4X4-16 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN5X5-32 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN5X5-40 |
Package Outline
|
Global Mixed-mode Techn...
|
