PART |
Description |
Maker |
CE201210-6N8J CE201210-5N6J CE201210-4N7J CE201210 |
IC,MOT,MC68HC908GR8CP, DIP-28, MCU FLASH 8BIT 8MHZ 4K IC,MCU,MC68HC908JB8ADW,8-BIT SOIC-28,21 I/O,3MHZ IC,MCU,MC68HC711E9CFN2,8-BIT 2MHz,PLCC52 8-BIT, OTPROM, 2.1 MHz, MICROCONTROLLER, PDIP20 IC,MCU,MC68HC908KX8CDW,8-BIT SOIC-16,13 I/O,8MHZ Multi-Layer Chip Inductors 1 ELEMENT, 0.12 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.0056 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.33 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.0027 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.0068 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.0082 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD IC,MCU,MC68HC705C9ACFN,8-BIT PLCC-44,31 I/O,2MHZ 多层片式电感 Multi-Layer Chip Inductors 1 ELEMENT, 0.39 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
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Bourns Inc. Bourns, Inc.
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M39P0R8070E2 M39P0R8070E2ZADE M39P0R8070E2ZADF |
256 or 512Mbit (x16, Multiple Bank, Multi-Level, Burst) Flash memory 128 Mbit Low Power SDRAM, 1.8V supply, Multi-Chip Package
|
Numonyx B.V
|
M36L0R7050L1ZAMF M36L0R7060U1 M36L0R7060U1ZAME M36 |
128 Mbit (Mux I/O, Multiple Bank, Multi-Level, Burst) Flash memory, 32 or 64 Mbit PSRAM, 1.8V supply Multi-Chip Package
|
STMicroelectronics
|
M39P0R9080E0ZAD M39P0R9080E0ZADE M39P0R9080E0ZADF |
512 Mbit (x16, Multiple Bank, Multi-Level, Burst) Flash Memory 256 Mbit Low Power SDRAM, 1.8V Supply, Multi-Chip Package
|
Numonyx B.V
|
CI201210-6N8J CI201210-5N6D CI201210-4N7D CI201210 |
Multi-Layer Chip Inductors 1 ELEMENT, 0.12 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.068 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.0015 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.0082 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.0047 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.39 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.18 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.018 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
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Bourns Inc. Bourns, Inc.
|
CS5543-KL CS5542 CS5542-KL CS5543 5542 CS5542/43 |
22-Bit, Multi-Channel Delta Sigma A/D Converter Chipset 22-Bit, Multi-Channel DS ADC Chip Set From old datasheet system
|
Cirrus Logic
|
CI100505-5N6D CI100505-R10J CI100505-8N2J CI100505 |
Multi-Layer Chip Inductors 1 ELEMENT, 0.0015 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.0022 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.068 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.082 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.0027 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
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Bourns Inc. Bourns, Inc.
|
MCH182AN103CC MCH185A103CC MCH185A103LL MCH185A103 |
1608(0603)Size chip capacitors Multi-layer ceramic chip capacitors
|
ROHM[Rohm]
|
LNJ312G8TRA LNJ312G8LRA LNJ812K8SRA LNJ212R8ARA LN |
Opto-Electronic Device - Visible Light Emitting Diodes - Chip LEDs Surface Mounting Chip LED TSS Type
|
Matsshita / Panasonic
|
LNJ107W5PRW |
Opto-Electronic Device - Visible Light Emitting Diodes - Chip LEDs Surface Mounting Chip LED S-GW Bi-Color Type
|
Matsshita / Panasonic
|
M36L0R7050L1ZAMF M36L0R7050L1ZAME M36L0R7060U1ZAMF |
128 Mbit (Mux I/O, Multiple Bank, Multi-Level, Burst) Flash memory, 32 or 64 Mbit PSRAM, 1.8V supply Multi-Chip Package 128兆位(复用的I / O,多银行,多层次,多突发)快闪记忆体264兆移动存储芯片,1.8V电源多芯片封 128 Mbit (Mux I/O, Multiple Bank, Multi-Level, Burst) Flash memory, 32 or 64 Mbit PSRAM, 1.8V supply Multi-Chip Package 128兆位(复用的I / O,多银行,多层次,多突发)快闪记忆体24兆移动存储芯片,1.8V电源多芯片封
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意法半导 STMicroelectronics N.V.
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