| PART |
Description |
Maker |
| 1201-066 |
FITER, SING, PI, BSHG
|
API Technologies Corp
|
| 1202-052 |
FLTR, SING, PI, BSHG
|
API Technologies Corp
|
| TD62309 TD62309F TD62309P E005652 |
From old datasheet system
6CH LOW SATURATION HIGH-CURRENT SINK DRIVER
6CH LOW SATURATION HIGH-CURRENT SING DRIVER
|
TOSHIBA[Toshiba Semiconductor]
|
| X558-5999-Z6-F X5585999Z6-F S5585999Z6-F |
10/100BT MAGNETICS MODULE
10/100BASE-T MODULE
10/100BTBASE-T MODULE
|
Bel Fuse Inc.
|
| HDPM01 |
HDPM01 module includes a pressure module and a compass module
|
Hope Microelectronics co., Ltd
|
| HAS030ZG-A HAS030ZJ-A HAS030YG HAS030YG-A HAS030YH |
Filter Module with Resistor Network 腐殖酸系 30
Xfmr Module 腐殖酸系 30
Transformers Only Module
HAS SERIES - 30 WATT
|
Atmel, Corp.
Positronic Industries, Inc.
POWER-ONE[Power-One]
|
| HYM72V1620GS-50 HYM72V1620GS-50- HYM72V1620GS-60 H |
16M x 72-Bit Dynamic RAM Module 16M X 72 FAST PAGE DRAM MODULE, 60 ns, DMA168
From old datasheet system
16M x 72-Bit Dynamic RAM Module (ECC - Module )
|
SIEMENS AG
Infineon
SIEMENS[Siemens Semiconductor Group]
|
| A1SJ71UC24-R2 A1SY81 A1SJ71UC24-R4 A1SNMCA-8KP A1S |
MODULE COMMS RS232
OUTPUT CARD SINK/SOURCE 32 P
MODULE COMMS RS422
MEMORY EPROM 8K GPP
INPUT CARD SINK/SOURCE 16 P
OUTPUT CARD SINK/SOURCE 16 P
MEMORY EPROM 2K
CPU MODULE 64K
通讯科的RS232模块
路RS422模块通讯
CPU MODULE 8K CPU模块8K
REMOTE I/O MODULE 远程I / O模块
|
飞思卡尔半导体(中国)有限公司
Electronic Theatre Controls, Inc.
|
| MC74HC00 MC54HC00AJ MC54HC00 MC74HC00A MC74HC00AN |
1.2 to 5.5 V 18-A, 12-V Input Non-Isolated Wide-Adjust Module 10-DIP MODULE -40 to 85 HC/UH SERIES, QUAD 2-INPUT NAND GATE, PDSO14
0.8 to 1.8 V 26-A, 12-V Input Non-Isolated Wide-Adjust Module 13-DIP MODULE -40 to 85
1.2 to 5.5 V 26-A, 12-V Input Non-Isolated Wide-Adjust Module 13-DIP MODULE -40 to 85
|
Motorola Mobility Holdings, Inc.
Motorola, Inc.
|
| C67076-A1053-A2 BSM191F |
SIMOPAC Module (Power module Single switch FREDFET N channel Enhancement mode) 28 A, 1000 V, 0.42 ohm, N-CHANNEL, Si, POWER, MOSFET
SIMOPAC ? Module
|
SIEMENS A G
SIEMENS AG
Infineon
SIEMENS[Siemens Semiconductor Group]
|
| JE93I9HTR5 JE9 JE9112HR1 JE9112HR2 JE9112HR3 JE911 |
Digital Media System-on-Chip (DMSoC) 338-NFBGA 大功率磁保持继电
2.0mV Quad Ultra Micropower Rail-to-Rail CMOS Operational Amplifier, 24L SOIC 大功率磁保持继电
HIGH POWER LATCHING RELAY 大功率磁保持继电
Energy Harvesting Module w/ connector, 1.8V to 3.6V, 4.6mJ, 68msec@25mA
Energy Harvesting Module w/ connector, 3.1V to 5.2V, 55mJ, 88msec@150mA
Energy Harvesting Module w/ connector, 3.1V to 5.2V, 8.3mJ, 80msec@25mA
Energy Harvesting Module w/ connector, 1.8V to 3.6V, 30mJ, 75msec@150mA
SOIC socket added to Adapter Module
|
Hongfa Relay
???瀹???靛０?′唤??????
Xiamen Hongfa Electroacoustic Co., Ltd.
厦门宏发电声股份有限公司
HONGFA[Hongfa Technology]
|
| Q67100-Q2077 Q67100-Q2078 HM72V400 HYM72V4000GS-50 |
4M x 72 Bit ECC DRAM Module
From old datasheet system
4M x 72-Bit Dynamic RAM Module 4M X 72 FAST PAGE DRAM MODULE, 50 ns, DMA168
4M x 72-Bit Dynamic RAM Module 4M X 72 FAST PAGE DRAM MODULE, 60 ns, DMA168
4M x 72-Bit Dynamic RAM Module 4米72位动态随机存储器模块
|
Infineon
SIEMENS[Siemens Semiconductor Group]
SIEMENS AG
|
