| PART |
Description |
Maker |
| MF0ICU1001W |
120 micro m Bumped sawn wafer on UV-tape contactless single-trip ticket ICs
|
NXP Semiconductors N.V.
|
| SL2ICS2001V1D |
I-CODE SLI Label IC bumped wafer specification on UV-tape
|
NXP
|
| 53325-1360 53325-0760 53325-0260 53325-1060 53325- |
2.0 WtB Wafer Assy RA 13Ckt 13 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER
2.0 WtB Wafer Assy RA 7Ckt 7 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER
2.0 WtB Wafer Assy RA 2Ckt 2 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER
2.0 WtB Wafer Assy RA 10Ckt 10 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER
Header; No. of Contacts:5; Pitch Spacing:2mm; No. of Rows:1; Series:Mi II; Connector Body Material:Nylon; Mounting Type:PC Board; Terminal Type:Right Angle Pin RoHS Compliant: Yes
5 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER
2.0 WtB Wafer Assy RA 11Ckt
11 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER
12 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER
|
Molex, Inc.
MOLEX INC
|
| IRG4CC50WB |
IGBT Die in Wafer Form 600 V Size 5 WARP Speed
IRG4CC50WB IGBT Die in Wafer Form
|
Hittite Microwave Corporation
International Rectifier
|
| 53358-1540 53358-0840 |
2.0 WtW Panel Mount Wafer Assy15CktWhite 15-15 CONTACT(S), MALE-MALE, CABLE MOUNT, PCB ADAPTER
2.0 WtW Panel Mount Wafer Assy 8CktWhite
|
Molex, Inc.
MOLEX INC
|
| 125SH-B-XX-TR-SMT-TR |
WAFER 90 SMT
|
Adam Technologies, Inc.
|
| 0690080350 |
Wafer Cutter
|
Molex Electronics Ltd.
|
| HFA04SD60S |
Hexfred Die in Wafer Form
|
International Rectifier
|
| FD060U02A5B |
Fred Die in Wafer Form
|
International Rectifier
|
| HF50A060ACE |
Hexfred Die in Wafer Form
|
International Rectifier
|
| SB065C040-3-W-AG |
Schottky cr Barrier Diode Wafer
|
TRANSYS Electronics Limited
|
|
