| PART |
Description |
Maker |
| ICS280PGLF ICS280 ICS280PG ICS280PGILF ICS280PGI |
From old datasheet system
Package Outline and Package Dimensions (16-pin TSSOP,173 Mil. Body) 封装和封装尺寸（16引脚TSSOP封装173军医。体
|
Integrated Circuit Solu...
ICSI[Integrated Circuit Solution Inc]
Intersil, Corp.
|
| 82325 PM2WE1OVG PM2WE1 |
Package Dimensions in mm
|
Vishay Intertechnology,Inc.
VISAY[Vishay Siliconix]
|
| TSSOP-8PIN |
Package Dimensions 封装尺寸
|
International Rectifier, Corp.
|
| ULTRATHIN-5PIN |
Package Dimensions 封装尺寸
|
International Rectifier, Corp.
IRF[International Rectifier]
|
| 081029131240 |
PACKAGE OUTLINE DIMENSIONS
|
Galaxy Semi-Conductor H...
|
| 8DIP300 |
8-DIP-300 Package Dimensions
|
FAIRCHILD[Fairchild Semiconductor]
|
| PM2KU1 |
From old datasheet system
Package Dimensions in mm
|
VISAY[Vishay Siliconix]
|
| 369A-13 |
MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS
|
ONSEMI[ON Semiconductor]
|
| 506AL |
MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS
|
ONSEMI[ON Semiconductor]
|
| DIMENSIONF5CPF6CP F6CP DIMENSION_F5CP_F6CP F5CP |
2.5 x 2.0mm package F5CP / F6CP Dimensions & Pin Configuration
|
Fujitsu Microelectronics
Fujitsu Component Limited.
FUJITSU[Fujitsu Media Devices Limited]
Fujitsu Limited
|
| RM-8 |
8-Lead Mini Small Outline Package [MSOP] Dimensions shown in millimeters
|
Analog Devices
|
| CB-9-1 |
9-Ball Wafer Level Chip Scale Package [WLCSP] Dimensions shown in millimeters
|
Analog Devices
|
