| PART |
Description |
Maker |
| CQFP |
Ceramic Quad Flat Pack Package
|
Amkor Technology
|
| TQFP |
Thin Profile Quad Flat Pack
|
STATS ChipPAC, Ltd.
|
| LQFP |
Low Profile Quad Flat Pack (LQFP) Packages
|
Amkor Technology
|
| MLP014A |
14-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5x3.0mm
|
Fairchild Semiconductor
|
| FLGA-SD |
Fine Pitch Land Grid Array - Stacked Die
|
STATSCHIP[STATS ChipPAC, Ltd.]
|
| 408-8737 |
The die assembly consists of an indenter die and nest die. Each die is held in the tool by a single screw
|
Tyco Electronics
|
| FP10-1200-13 |
Power Transformer PC Mount: Flat Pack
|
TRIAD MAGNETICS
|
| FP10-4800 |
Power Transformer PC Mount: Flat Pack
|
TRIAD MAGNETICS
|
| FP40-300 |
Power Transformer PC Mount: Flat Pack
|
TRIAD MAGNETICS
|
| CLA101 |
1x4 phototransistor array, 5 leaded flat-pack
|
Clairex Technologies
|
| VCXO |
Space VCXO - Voltage Controlled Crystal Oscillator Flat Pack, General Specification (rev1)
|
TEMEX
|
