PART |
Description |
Maker |
TFS150L |
Development specification
|
Vectron International, ...
|
M8PSDSOFT M8DKFL M8DKFL-101 M8DKPRO M8DKPRO-K52-11 |
M8 FLASH PSD System Development Tools M8 FLASHPSD System Development Tools 头M8 FLASHPSD系统开发工 M8 FLASHPSD System Development Tools M8 FLASHPSD系统开发工 CONNECTOR ACCESSORY
|
SGS Thomson Microelectronics STMicroelectronics N.V. ST Microelectronics 意法半导 STMICROELECTRONICS[STMicroelectronics]
|
ST7MDT1-110 ST7MDT1-220 ST7MDT1-DVP ST7MDT1-UK 613 |
MDT1-DVP LOW COST ST7 DEVELOPMENT KIT DATASHEET From old datasheet system A LOW-COST DEVELOPMENT PACKAGE INCLUDING A FULL REAL-TIME EMULATION BOARD MDT1-DVP LOW COST ST7 DEVELOPMENT KIT DATASHEET
|
意法半导 STMICROELECTRONICS[STMicroelectronics] ST Microelectronics
|
CONFIG2 CONFIG0 CONFIG1 DSUMFT311EV |
The FT311D Development Module is a development module which utilises the FT311D IC to develop USB accessories connecting to Android platforms via Android Open Accessory mode.
|
Future Technology Devices International Ltd.
|
ST7MDT2 ST7MDT2-110 ST7MDT2-220 ST7MDT2-DVP ST7MDT |
A Low-Cost Development Package Including A Full Real-Time Emulation Board(低价格开发软件包) MDT2-DVP LOW COST ST7 DEVELOPMENT KIT DATASHEET MOSFET; Transistor Polarity:Dual N/P Channel; Drain Source Voltage, Vds:30V; Continuous Drain Current, Id:51A; On-Resistance, Rds(on):0.36ohm; Rds(on) Test Voltage, Vgs:10V; Package/Case:6-TSOP; Drain-Source Breakdown Voltage:30V From old datasheet system MDT2-DVP LOW COST ST7 DEVELOPMENT KIT DATASHEET
|
意法半导 STMICROELECTRONICS[STMicroelectronics] ST Microelectronics
|
SG-30131-2 SG-30550-2 SG-MOTHER-2 SG-703107-1 SG-7 |
Evaluation board for RISC microcontroller software development Evaluation board for software development of RISC microprocessor
|
NEC
|
MCF5282 MCF528X MCF5206E MCF5272 MCF5214 MCF5216 M |
CodeWarrior Development Studio for ColdFire? Architectures CodeWarrior Development Studio for ColdFire㈢ Architectures
|
http:// FREESCALE[Freescale Semiconductor, Inc] Freescale Semiconductor...
|
DVM1821Z-A0 DVK1821Z-A0 |
Development kit
|
SOLOMON SYSTECH
|
FCBGA |
Package sizes from 10 mm to 55 mm (60 mm and 65 mm in development)
|
Amkor Technology
|
SMP8634 |
WinCE BSP And Development Help
|
Sigma Designs
|