| PART |
Description |
Maker |
| QFP-SD |
Stacked Die Quad Flat Pack
|
STATSCHIP[STATS ChipPAC, Ltd.]
|
| TQFP |
Thin Profile Quad Flat Pack
|
STATS ChipPAC, Ltd.
|
| MQFP-D |
Heat Spreader Metric Quad Flat Pack
|
STATSCHIP[STATS ChipPAC, Ltd.]
|
| IRUH33P183A1M |
HiRel Fixed 1.8V Output Voltage Ultra Low Dropout Linear Radiation Hardened Regulator in a 8-Lead Flat Pack Package
|
International Rectifier
|
| SOT389-1 |
Plastic Low Profile Quad flat Package
|
NXP Semiconductors
Philips Semiconductors
|
| SOT545-3 |
plastic thermal enganced thin quad flat package
|
Philips Semiconductors
|
| FPT-208P-M06 |
LOW PROFILE QUAD FLAT PACKAGE 208 PIN PLASTIC
|
Fujitsu Limited
Fujitsu Microelectronics
FUJITSU[Fujitsu Media Devices Limited]
Fujitsu Component Limited.
|
| SFH6916 |
Optocoupler, Phototransistor Output, Quad Channel, SOP-16, Half Pitch Mini-Flat Package
|
VISAY[Vishay Siliconix]
|
| TCMT1600 |
(TCMT1600 /TCMT4600) Optocoupler / Single/Quad Channel / Half Pitch Mini-Flat Package
|
Vishay
|
| FP88-130 |
PC Mount: Flat Pack
|
TRIAD MAGNETICS
|
| LXZT-374KHZ LXZT-429KHZ LXZT-249KHZ LXZT-375KHZ LX |
CERAMIC RESONATOR, 0.374 MHz ROHS COMPLIANT, CERAMIC PACKAGE-2
CERAMIC RESONATOR, 0.429 MHz ROHS COMPLIANT, CERAMIC PACKAGE-2
CERAMIC RESONATOR, 0.249 MHz ROHS COMPLIANT, CERAMIC PACKAGE-2
CERAMIC RESONATOR, 0.375 MHz ROHS COMPLIANT, CERAMIC PACKAGE-2
CERAMIC RESONATOR, 0.999 MHz ROHS COMPLIANT, CERAMIC PACKAGE-2
|
Abracon, Corp.
|
| SC16C754BIBM128 |
5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 64-byte FIFOs; Package: SOT414-1 (LQFP64); Container: Reel Pack, SMD, 13", Turned 4 CHANNEL(S), 5M bps, SERIAL COMM CONTROLLER, PQFP64
|
NXP Semiconductors N.V.
|
