| PART |
Description |
Maker |
| YS246DD-15 |
HYBRID IC FOR ON-BOARD POWER SUPPLY
|
Isahaya Electronics Corporation
|
| YS123DD-12 |
HYBRID IC FOR ON-BOARD POWER SUPPLY
|
Isahaya Electronics Corporation
|
| YS056DS-15 |
HYBRID IC FOR ON-BOARD POWER SUPPLY
|
Isahaya Electronics Corporation
|
| YS123DS-12 |
HYBRID IC FOR ON-BOARD POWER SUPPLY
|
Isahaya Electronics Corporation
|
| M57145L-01 |
HYBRID IC FOR ON-BOARD POWER SUPPLY
Integrated Gate Bipolar Transistor (IGBT) Modules: 250V
|
Mitsubishi Electric Semiconductor
Mitsubishi Electric Corporation
|
| SPH4692 |
Power Hybrid with Power MOSFET for SMPS
Siemens Power Hybrid for SMPS
From old datasheet system
|
Infineon
Siemens Semiconductor Group
|
| STK760-221A-E |
Thick-Film Hybrid IC Single-phase Rectification PFC Hybrid IC
|
Sanyo Semicon Device
|
| 3032 3032SERIES 3032-6017-00 3032-6019-00 |
CRYSTAL, 3.686400MHZ 20PF HC-49
90?Crossover Hybrid Coupler 800-900锛?890-960. or 1700-1900 MHz
90Crossover Hybrid Coupler 800-900890-960. or 1700-1900 MHz 90？交叉混合耦合800-90090-960。兆赫或1700年至00
Low-Power, Single-/Dual-Level Battery Monitors with Hysteresis and Integrated µP Reset 90？交叉混合耦合800-90090-960。兆赫或1700年至00
90 CROSSOVER HYBRID COUPLER 800-900/890-960/ OR 1700-1900 MHZ
90 CROSSOVER HYBRID COUPLER 800-900,890-960, OR 1700-1900 MHZ
|
PHOENIX CONTACT Deutschland GmbH
Tyco Electronics
|
| 0736562000 73656-2000 |
2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Power Module, Vertical, SMC,Power Receptacle, 3 Circuits, Gold (Au) 0.76渭m (30渭")
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Power Module, Vertical, SMC,Power Receptacle, 3 Circuits, Gold (Au) 0.76μm (30μ)
|
Molex Electronics Ltd.
|
| HJD-2Z-1.9G |
1800 MHz - 1990 MHz RF/MICROWAVE 180 DEGREE HYBRID COUPLER, 0.3 dB INSERTION LOSS-MAX
HYBRID JUNCTION
|
MERRIMAC INDUSTRIES INC
Merrimac Industries, Inc.
|
| MSK4351ED |
50 AMP, 500 VOLT IGBT PLUS DIODE FULLY ISOLATED SMART POWER 3-PHASE MOTOR DRIVE POWER HYBRID
|
ETC
|
| MHPM7B12A120A |
Hybrid Power Module
|
MOTOROLA[Motorola, Inc]
|
